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| [November 15, 2012] |
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FCI and 3M Announce Second-source Agreement for HPCE and HP2 Power Products
AUSTIN, Texas --(Business Wire)--
FCI, a leading supplier of power products and interconnect systems, and
3M (News - Alert) have entered into a second-source agreement covering the High Power
Card Edge (HPCE®) and HP2™ power product families.
"We are excited about this opportunity," said Dong Yu, global power
portfolio director at FCI. "Working with 3M will drive the standard for
low-profile, high-efficiency power connectors and cable assemblies. HPCE
already has great traction in the market and HP2 will further extend the
family with innovative, two-piece solutions for board-to-board and
cable-to-board applications."
"3M is extremely pleased to work with FCI by providing the industry with
a second source of FCI's innovative HPCE and HP2 power connectors and
cable assemblies," said David Schneider, global business manager for
interconnect, 3M
Electronic Solutions Division. "FCI's expertise in power product
design and 3M's expertise in connector technology and material science
is a good match to offer a standard, dual-sourced power solution."
The HPCE connector is a next-generation power card edge connector for
demanding applications requiring high linear current density and low
power loss. HPCE offers a low profile height (2.8 mm for straddle mount
and 7.5 mm for right angle) and is based on very cost-effective and
highly reliable stamped-and-formed power contact technology similar to
othe power solutions from FCI.
The HPCE connector incorporates an innovative power contact and housing
design that permits a more compact and lower profile package for
demanding AC and DC power supply and/or add-in card applications. HPCE's
low profile height (for maximized airflow), significantly increased
linear current density and low contact resistance characteristics are
ideal for next generation 1U/2U servers, storage enclosures,
telecommunications equipment and datacom/networking equipment.
The innovative HPCE cable-to-card edge is available with the same
desirable features as the standard HPCE board mount product but is
focused on power distribution applications via cabling. It includes high
power (10 - 14 AWG wire) and low power (14 - 16 AWG wire) contact
options as well as integrated signal contacts (22 - 26 AWG wire). The
modular tooling approach maximizes flexibility to meet a wide range of
power distribution requirements including bus bar attachment. The
integrated latching option makes it ideal for high shock-and-vibration
environments.
The HP2 product is similar to HPCE but utilizes a two-piece design
(header-to-receptacle connectors/cable assemblies). Integrated guide
features make it ideal for blindmate applications where system guidance
is not readily available. The HP2 product is available in board-to-board
and cable-to-board configurations and includes power contacts for power
distribution and signal contacts for power control.
3M anticipates having the connectors available in early 2013.
About 3M Electronic Solution Division - Interconnect 3M
Electronic Solutions Division's Interconnect business offers a variety
of innovative connectors, cables and cable assemblies, embedded
capacitance materials and Textool brand test and burn-in sockets for
component engineers and designers in the electronics industry. For more
information about 3M's interconnect solutions, visit: http://www.3Mconnectors.com.
Information about 3M Company is available online.
About FCI With operations in 30 countries, FCI is a leading
manufacturer of connectors. Our 14,000 employees are committed to
providing customers with high-quality, innovative products for a wide
range of consumer and industrial applications. For more information: http://www.fci.com
3M and Textool are trademarks of 3M Company. HPCE® and HP2®
are registered trademarks of FCI. All other trademarks, names and brands
listed herein are property of their respective owners and/or companies.

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