Global wireless connectivity solutions provider Option has launched a new 4G LTE (News - Alert) module, the GTM801, which is footprint compatible with the 3G LGA module, the GTM601. As a result, according to Options, its embedded solutions now provide flexible alternatives, allowing manufacturers to design tablets or ultra-portable notebooks using the same layout for either 3G with the GTM601 or 4G LTE with the GTM801 to meet diverse market needs.
Last December, Option reported successful data interoperability testing (IOT) of GTM 601W wireless module on the mobile broadband network of NTT (News - Alert) DOCOMO. The GTM 601W is the first Option's LGA wireless module to have completed IOT on the operator's mobile broadband network.
According to Options, both modules are designed to support Windows 8 and the USB-IF Mobile Broadband Interface (MBIM) specification. The GTM801 is designed around Qualcomm's (News - Alert) Gobi 4G LTE chipset, the MDM9215. Option has a long-standing relationship with Qualcomm and uses Gobi chipsets across its entire module portfolio.
In a statement, said Bernard Schaballie, general manager of Embedded Solutions at Option, "Option continues to provide leadership by delivering a connectivity portfolio that is flexible, scalable and footprint compatible. Option connectivity solutions are able to support next generation operating systems and networks by using cutting edge chipset technology from Qualcomm."
In another statement, Fram Akiki, senior director, product management at Qualcomm, commented, "We are enthusiastic to see Option providing innovative, thin solutions for mobile devices." "Our Qualcomm Gobi 3G and 4G LTE chipsets enable connectivity for a broad range of devices," stated Akiki.
Option is displaying its embedded solutions at Embedded World in Nuremberg, Germany. Headquartered in Belgium, the company maintains offices in Europe, the U.S., Greater China, Japan and Australia.
Edited by Tammy Wolf