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RadiSys Supports PICMG Computer-On-Module Express 2.0 Specification

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September 02, 2010

RadiSys Supports PICMG Computer-On-Module Express 2.0 Specification

By Anuradha Shukla, TMCnet Contributor


RadiSys Corporation, a provider of hardware and software platforms for next-generation IP-based wireless, wireline and video networks, endorses the PICMG (News - Alert) Computer-On-Module (COM) Express 2.0 specification.


Built on the success of the COM Express 1.0 specification, the COM Express 2.0 specification supports new interfaces while dealing with obsolescence problems with existing interfaces. Transaction terminals, digital signage, medical devices and certain video-intensive applications in the mil/aero market like radar or imaging equipment are some of the applications that will take advantage of these new attributes.

Bob Pebly, the chief technology officer fellow of RadiSys (News - Alert), said that the company was a founding specification author of the original COM Express 1.0 specification. RadiSys was again a head in the revision process that resulted in the newly adopted and ratified COM Express 2.0 specification and will use its extensive experience with the specification to support its customers, whether they choose to migrate to COM Express 2.0 or stay with their current platforms.

A new module size and two new module Types are added to the COM Express library in the COM Express 2.0 specification. COM Express 2.0 features the Compact module size of 95x95mm to mirror the switch toward smaller integrated system-on-a-chip designs and integrated chipsets.

The specification also marks the Type 6 and Type 10 modules for broader technology upgrades. Type 6 deals with the need for digital display and USB 3.0 interfaces. It presents an easy upgrade path for Type 2-based designs that already exist. Type 10 is a single connector version that is comparable to Type 1. It makes the most use of the single connector module display interfaces for future designs. Both Type 6 and Type 10 are made to maintain backwards compatibility to the maximum extent possible and present an easy integration with the least application changes.

Three Digital Display Interfaces, High-Definition Multimedia Interface (HDMI), DisplayPort and SDVO interfaces can be supported by the COM Express 2.0 specification. USB 3.0 is also supported while adding 2 more PCI (News - Alert) Express lanes. Added interfaces have been integrated to upgrade audio and digital support, as well as introduce new capabilities like content protection.


Anuradha Shukla is a contributing editor for TMCnet. To read more of Anuradha’s article, please visit her columnist page.

Edited by Stefania Viscusi







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