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Telecom Platform Deployment: Virtium Unveils 8GB VLP RDIMM Monolithic Module


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December 20, 2011

Telecom Platform Deployment: Virtium Unveils 8GB VLP RDIMM Monolithic Module

By Rajani Baburajan, TMCnet Contributor

Virtium Technology, a designer and manufacturer of industrial memory and flash storage solutions for OEMs that power telecom platform deployments, has launched its high speed PC3-12800 (DDR3-1600) 8GB VLP RDIMM industrial memory module, using 2Gbit monolithic components.

Designed for high performance bandwidth ATCA blade applications, the new DDR3-1600 RDIMM module fulfills the current demand for high speed memory in DDR3-1600 compatible systems.

"Virtium's latest DDR3-1600 RDIMM is designed to meet high speed ATCA system requirements," said Phan Hoang, vice president of Research & Development at Virtium, in a statement. “This design demonstrates the strength of our engineering team. Our years of experience in the industry and collaboration with engineers at major OEMs allow us to continually release such a high-speed, high-density memory module in a very low profile DIMM form factor."

The high-density 8GB dual rank module utilizes x4 2Gbit DRAM monolithic components in the JEDEC standard pin-out and a VLP module at a height of 18.29 mm (.72 inches). The company has also released the ULP (ultra-low profile) module, coming in at 17.78 mm height (.70 inches) and designed for even more space-constrained applications.

Both VLP and ULP modules are available in standard 1.5v or 1.35v low power design for optimal power savings, the company said. The solutions feature a heat spreader and are lead-free and ROHS compliant.

Virtium's industrial memory modules encompass a wide range of densities and low profile DIMM form factors for telecom platform deployment environments. Virtium's TuffDrive Flash Storage Solutions are offered in a wide range of interfaces, densities and form factors including Industrial Temperature CF, CFAST, SlimSATA, mSATA, eUSB, SD Card, 1.8" SSD and 2.5" SSD.

A recent TMCnet article highlights three important issues that the telecom platform deployment industry is currently facing. Read the full article here.

Rajani Baburajan is a contributing editor for TMCnet. To read more of Rajani's articles, please visit her columnist page.

Edited by Jamie Epstein

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