Radisys Corporation, a provider of embedded wireless infrastructure solutions for a wide range of telecom platform deployment scenarios, recently launched the CEQM77 family of ultra-portable COM Express modules for graphics and processing-intensive applications.
Based on the third-generation Intel (News - Alert) Core i7 processors, the CEQM77 family of COM Express modules combines quad and dual-core performance. It powers the latest graphics technology and processing improvements, meeting the needs of applications such as in-vehicle systems, test and measurement, medical imaging and network enterprise systems.
With support for error-correcting code (ECC) memory and a -40C to +85C temperature range, the CEQM77 has applications in the aerospace and defense (A&D), medical and enterprise markets.
In military systems, the CEQM77 family of devices will offer ultra-high processing and graphics capabilities to ensure optimal situational awareness, as well as ECC memory to ensure data integrity for mission-critical applications. The CEQM77 module with ECC memory is specifically designed and tested to withstand extreme military conditions and meet the processing-intensive needs for these applications.
“The combination of ruggedness, reliability and performance in Radisys’ COM Express modules enables our customers to implement an entire system or network that can be picked up and moved to meet changing battlefield situations,” said Jennifer Zickel, COM Express product line manager, Radisys, in a statement.
When combined with Radisys’ Trillium 3G and LTE (News - Alert) wireless software, the COM Express portfolio enables ruggedized portable wireless end-to-end telecom platform deployment solutions including the full core network, in a 60mm x 120mm x 150mm package, according to Zickel.
“In addition, our Software Media Server performs multimedia packet processing for real-time communication applications in the battlefield, like push-to-talk services over ad-hoc cellular networks,” Zickel further added.
Radisys’ CEQM77 also provides a 20 percent processing performance increase and twofold graphics acceleration over the previous generation module, thanks to third-generation Intel Core i7 processors. Additionally, the processors extend product lifetime and maintain a smooth upgrade path for previous COM Express-based applications.
Edited by Jamie Epstein