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TE Connectivity (News - Alert), a provider of Ethernet and telecom connectivity solutions, launched a new universal connectivity platform. Designed for speed and flexibility, the platform will facilitate data center migration from 1 to 100 GbE.

UCP, the advanced modular cabling concept, will support both copper and fiber component cabling. Ideal for rapidly changing network communications infrastructure environments where space is at a premium, the platform will also provide superior rack efficiency.

Officials confirmed that TE’s UCP concept boasts of a wide range of TE components including: patch panels, subfloor panel, overhead panel mounts, preterminated links and adaptor modules.

A common patch panel helps accommodate both copper and fiber and can be installed within or outside the 19-inch envelope.

In a statement, Brian Davis, senior product manager at TE Enterprise Networks, said that “Rack space is always an issue in the data center or telecommunications closet. The universal connectivity platform helps alleviate space challenges through its modular design and impressive feature set.”

“While we do see a continued migration to fiber connectivity, most data centers today combine fiber and copper to some degree” Davis added. “The universal connectivity platform helps our customers manage the two media in a cost-effective way, while strategically adding flexibility and scalability to their networks. It just makes sense.”

The UCP solution features UCP patch panels, UCP drawer-style enclosures, preterminated fiber and copper quick-fit cassettes, UCP fiber quick-fit modules, UCP copper quick-fit modules and Zero rack unit accessories.

In related TMC (News - Alert) news, TE Connectivity announced that it has joined the Open Data Center Alliance, which was founded with the mission of defining requirements for next-generation data center and cloud infrastructures.