Limited airflow and high cross talk are becoming recurring problems in many servers and computing systems. Molex (News - Alert) Incorporated, a provider of complete interconnect solutions, comes with a new high-density iPass+ zHD vertical connectors that solves these issues.
Meant for midplane or other non-edge-board applications, the iPass (News - Alert)+ zHD vertical connector provides excellent signal integrity performance while maintaining a small footprint on the PCB. These connectors improve system airflow and signal integrity by eliminating mid-plane connections
Joe Dambach, new product development manager at Molex, confirmed that the new iPass+ zHD vertical connector system provides a 0.75mm pitch vertical connector that meets requirements of SAS (News - Alert)-3 and projected SAS-4 bandwidths.
Available in multiple configurations, the new iPass+ zHD connectors accommodate a range of high-density data and networking applications. Delivering a robust and secure connection, the connectors are scalable up to 96 Gbps data rates. Moreover, the waferized connector design optimizes the PCB footprint with low insertion loss, low integrated cross-talk noise, low return loss and only minimal performance variation across all high-speed channels.
“Innovative iPass+ zHD vertical connectors deliver Molex customers a virtually future-proof new connector design for SAS-3 and projected SAS-4 high-speed server-storage networks,” Dambach added.
Molex vertical press-fit iPass+ zHD connector is also noted to nearly double the number of ports on the PCB, compared to conventional iPass connectors. The connectors mate to all current miniSAS HD passive copper, active copper and optical cable assemblies, the company said.
Molex has also announced a new development in LED array holder technology with integral electrical, mechanical and optical connectivity for optimal performance, to simplify design integration for lighting manufacturers.
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Edited by Braden Becker