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Super Micro Computer Builds High-Capacity Storage Using 3U PCI-E SuperServer

Enterprise Solutions Featured Article

November 20, 2012

Super Micro Computer Builds High-Capacity Storage Using 3U PCI-E SuperServer

By Nathesh
TMCnet Contributor

Super Micro Computer, a provider of advanced server Building Block Solutions, said that it managed to blend the prowess of 10 2.4TB Fusion ioDrive2 Duo ioMemory products with the Supermicro 3U 11x PCI (News - Alert)-E SuperServer to design a new high-performance, high-capacity storage appliance that can deliver unparalleled levels of performance and density.


The dual Intel (News - Alert) Xeon processor E5-2600 based platform is slated to be equipped with up to 10 2.4TB Fusion ioDrive2 Duo with 3GB/s and 935K IOPs and has an extra PCI-E 2.0 x4 (in x8) slot that can be fitted with a Supermicro 10GbE or FDR/QDR InfiniBand add-on card.

Some of the notable features of Supermicro’s 3U 11x PCI-E SuperServer are; up to 512GB DDR3 1600MHz ECC; 16x DIMM sockets; expansion slots such as 10xPCI-E 3.0x8, 1xPCI-E2.0x4 (in x8); Intel i350 Dual port Gigabit Ethernet; eight hot-swap 3.5-inch HDD bays; two 5.25-inch drive bays; server remote management – IPMI 2.0 / KVM over LAN / media over LAN; three middle fans and one rear exhaust fan; and more.

Fusion-io (News - Alert) explained that its 2.4 TB ioDrive2 Duo allows organizations to handle twice the transactions, queries, and requests; add capacity for future growth; ensure applications seamlessly handle larger traffic spikes; and consolidate more infrastructures.

Wally Liaw, vice president of sales at Supermicro, commented, “Supermicro designs solutions such as our 11x PCI-E slot SuperServer for maximum performance, efficiency and expandability and our open platforms create groundbreaking opportunities like this collaboration with Fusion-io. This new ultra high performance 24TB storage solution is the foundation for new products in our pipeline and we are looking forward to incorporate upcoming Fusion-io technologies into select HPC servers for even greater storage density at higher IOPs for the most demanding, cutting edge applications.”

Supermicro’s newly announced Fusion powered appliance is supposed to deliver massive throughput and capacity in a very small footprint for highly efficient application acceleration.

Want to learn more about the latest in communications and technology? Then be sure to attend ITEXPO Miami 2013, Jan 29- Feb. 1 in Miami, Florida.  Stay in touch with everything happening at ITEXPO (News - Alert). Follow us on Twitter.




Edited by Brooke Neuman

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