NXP Semiconductors (News - Alert) has deployed Tensilica's ConnX Baseband Engine (BBE) DSP core, as stated a recent press release.
According to the release, NXP Semiconductors successfully fabricated Tensilica’s ConnX Baseband Engine DSP (digital signal processor) in its automotive multi-standard software defined radio innovation platform.
NXP Semiconductors offers mixed signal and standard product solutions that utilize RF, analog, power management, interface, security and digital processing expertise. These solutions are used in a wide array of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications.
As a provider of dataplane processor IP cores, Tensilica (News - Alert) offered NXP Semiconductors with ConnX Baseband Engine DSP in NXP’s automotive multi-standard software defined radio innovation platform.
NXP’s automotive multi-standard software defined radio innovation platform is a baseband processor for satellite and terrestrial digital radio and mobile HDTV (high-definition television) as well as car2X communication.
According to the release, the ConnX BBE DSP processor is being deployed in multiple Intelligent Traffic System Field Trials around the globe in car2X communication.
Andrew Turley, director of innovation for Car Entertainment, NXP, said in a statement, "Tensilica presented us with an intriguing application for their customizable dataplane processor technology and we worked with Tensilica to evolve that into a product that worked very well for our requirements. We needed a DSP that went well beyond what else we could find on the market in terms of optimum power/performance/area."
Turley added, "NXP and Tensilica worked together to get a truly optimized solution that has the necessary DSP performance to tackle multi-standard next-generation digital radio applications in a small and power-efficient core."
"We are honored that NXP, as the market leader for car entertainment semiconductors, has selected Tensilica as their DSP provider and was a lead partner for our ConnX BBE," said Jack Guedj, president and CEO, for Tensilica. "Our collaboration with NXP has helped us optimize our ConnX BBE and validates the benefits of Tensilica's customizable dataplane processors (DPUs) to build the most efficient digital signal processing engines for mobile wireless communications."
Tensilica’s dataplane processor IP cores, also called as DPUs combine the key features of DSPs and CPUs. In addition, these cores are capable of delivering 10 to 100 times more performance. According to the company, these DPUs power SOC designs at system OEMs.
In recent news, Tensilica unveiled the HiFi 3 audio/voice DSP IP (intellectual property) core for SOC (system-on-chip) design. This core is the fourth-generation audio DSP that provides higher performance with lower power for high-performance audio post-processing and voice processing algorithms used in smartphone and home entertainment systems.
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Edited by Rich Steeves