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Apple Files Two New Patents Suggesting New Earphones

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April 13, 2012

Apple Files Two New Patents Suggesting New Earphones

By Rory Lidstone, TMCnet Contributing Writer

The major, and often only complaint when someone buys an Apple (News - Alert) iPod or iPhone is that the included earphones aren't the best. Well, it seems as though Apple wants to tackle that issue, at least to some extent, according to Business Insider.

It seems that the Cupertino-based hardware giant recently filed a patent application with the title "Ultrasonically Welded Structures and Methods for Making the Same,” describing a process which can weld to separate pieces of any material can be welded together, resulting in a seamless look.

Apple also filed a separate patent application earlier this week entitled "Curved Plastic Object and Systems and Methods for Deburring the Same", which outlines a process for building curved plastic objects appearing to be headphone grilles.

Both patents detail separate processes for creating a polished, seamless product, suggesting another sleek, groundbreaking design – adjectives used to describe pretty much every Apple product in recent years. There is no information, however, regarding the drivers that may appear in these futuristic earphones, since the only information available are the two patent applications.

It's unlikely these hypothetical new earphones would receive much of an upgrade in sound quality, though, since stock earphones are rarely known for excellence in that area.

Perhaps we can look forward to these futuristic new earphones being launched quietly alongside the next iPhone (News - Alert), or maybe they'll be given some fanfare. Either way, if these earphones do release alongside the next generation of iDevices, they'll quickly eat up as much of the headphone market much like the iPhone has managed to corner a fair chunk of the cellphone market.

In any case, it's likely they will receive a passionate response from Apple fans.

Jeff Hayashida, Jonathan Aase, Rico Zorkendorfer and Evans M. Hankey are credited on the ultrasonic welding patent application while Hayashida and Aase's names also appear on the curved plastic application.

Edited by Braden Becker

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