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Cinterion's Latest Series Includes Intel Chipset Technology

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Cinterion's Latest Series Includes Intel Chipset Technology


November 21, 2012

By Meenakshi Shankar, TMCnet Contributor

Cinterion, a Gemalto (News - Alert) Company specializing in wireless machine-to-machine communication solutions, launched its first machine-to-machine module series in the convenient PCI Express Mini Card form factor.

The newly launched Cinterion (News - Alert) EHS5 miniPCIe and Cinterion BGS2 miniPCIe includes the latest Intel chipset technology and a standard PCI Express Mini Card system connector to simplify cellular connectivity and provide easy access to cloud services. Ruggedized for extreme industrial environments, it is reliable for machines placed outdoors in snow and ice, or with equipment inside industrial facilities that lack heating and cooling systems. The device can be customized by request to include soldered Machine Identification Modules (MIMs) for enhanced security.

“Our expanding relationship with Intel (News - Alert) has led to three new Cinterion ISA product offerings this year providing alliance members with secure connectivity and simplified field deployment,” Norbert Muhrer (News - Alert), senior vice president of Cinterion machine-to-machine segment at Gemalto said in a statement.

“The Cinterion machine-to-machine miniPCIe is a new product family specifically designed to address customers using Intel processors who want to deploy seamlessly connected intelligent systems. By providing the easiest way to connect industrial systems to cloud services, Cinterion is supporting a new breed of enterprise smart services for the future,” Muhrer added.

Cinterion’s new series features easy, plug-and-play installation and allows equipment such as vending machines to send inventory and status updates and integrated digital signs to download new advertising campaigns using cellular technology. Supervisors are alerted in real time when items need replenishing or when deliveries can be postponed, which helps optimize operations and save time and fuel costs.

Also, the product is noted to help global Intel intelligent systems alliance partners and original equipment manufacturers to simplify and accelerate development of innovative machine-to-machine applications. The device combines Cinterion modules with a long-life Intel chipset.

Helmut Vogler, vice president and general manager of mobile and wireless sales for Intel Corporation, emphasized Cinterion’s ability to provide cost-efficient, machine-to-machine-grade solutions to the wide variety of Intel-based systems and mentioned it is an important part to help the company’s ISA partners embrace machine-to-machine solutions.

Vogler also said that within the intelligent system framework Intel will promote these new Cinterion solutions into the various and rapidly growing markets of connected systems.

Another news release indicated that Cinterion has launched PXS8, the first industrial-grade multimode M2M module that enables global roaming for voice and data communications.

Want to learn more about M2M technologies? Don’t miss the M2M Evolution Conference, collocated with ITEXPO Miami 2013, Jan 29- Feb. 1 in Miami, Florida.  Stay in touch with everything happening at M2M Evolution Conference. Follow us on Twitter.

Edited by Rich Steeves

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