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Taiwan Semiconductor Manufacturing Assigned Patent(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Sept. 11 -- Taiwan Semiconductor Manufacturing, Hsin-Chu, Taiwan, has been assigned a patent (8,261,219) developed by four co-inventors for a "system on chip development with reconfigurable multi-project wafer technology." The co-inventors are Kun-Lung Chen, Taipei, Taiwan, Shine Chien Chung, Taipei Hsien, Taiwan, Yung-Chin Hou, Taipei, Taiwan, and Yu-Chun Wu, Allentown, Pa. The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method is disclosed for designing a semiconductor circuit on a multi-project wafer (MPW). One or more standard modules designed by one or more vendors with verified functions are first identified. Some of the standard modules are charged based on usage. At least one reconfigurable module of the MPW is programmed by making one or more connections through one or more connection layers. The standard modules are further connected with the programmed reconfigurable module according to the predetermined design of the circuit. The completed circuit is then verified for final uses." The patent application was filed on June 4, 2008 (12/133,323). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,261,219&OS=8,261,219&RS=8,261,219 Written by Satyaban Rath; edited by Hemanta Panigrahi. SR0911HP0911-783092 (c) 2012 Targeted News Service [ Back To TMCnet.com's Homepage ] |