Research and Markets: Thin-Film Integrated Passive Devices (IPDs) 2012 - Market Growing within ESD/EMI Protection, LED, RF, Digital & Mixed Signal Applications

DUBLIN --(Business Wire)--

Research and Markets (http://www.researchandmarkets.com/research/pc663f/thinfilm) has announced the addition of the "Thin-Film Integrated Passive Devices (IPDs) 2012" report to their offering.

Thin-film integrated passive & active devices are rapidly growing within ESD/EMI protection, LED, RF, digital & mixed signal applications

A 2X (News - Alert) GROWTH IS EXPECTED IN THE NEXT 5 YEARS WITHIN THE ELECTRONICS INDUSTRY

From a commodity technology initially developed to replace bulky discrete passive components, thin-film Integrated Passive Devices (IPDs) are now a growing industry trend driven by RF, High Brightness LEDs, ESD and EMI protection, and Digital and Mixed Signal applications. This new research study on thin-film Integrated Passive and Active Devices estimates the total IPD market to grow from more than $610M this year to over $1.2B by 2017 with a CAGR of 12%.

ESD and EMI protection IPD revenues are stabilizing, primarily due to the recent decline of NOKIA in the mobile space. NOKIA has been the main driving OEM for the integration of IPDs in volume, with many handsets having from 10 to 15 ESD and EMI protection IPDs per system. It remains to be seen which OEMs will take over NOKIA's leadership in the integration of IPDs If Sony-Ericsson (News - Alert) and Motorola have adopted the technology to limited volume, Apple recently started to adopt more ad more IPD components into its end-products, while Samsung (News - Alert) recently has been quite conservative in adopting this technology.

With a CAGR of almost 25%, the ESD and TVS protection of high power LED will be the fastest growing field of application for IPD protection components in the next five years. RF IPDs are also growing, with a CAGR of -17% expected in the next 5 years. Next generation RF (such as UWB, ZigBee, LTE (News - Alert), etc) is the highest growth sub-sector, as RF IPD technology offers the best value proposition in terms of matching accuracy performance, miniaturization, flexible chip to package configuration and fastest time to market solution. Digital and Mixed Signal IPD is still a very small market space. This application has the potential to take-off once IPDs reach the density and electrical performance requirements of DC-DC converter modules and high performance 2.5D silicon digital interposer substrates. Ramp-up is likely to take-off in the 2013-2015 time frame for both applications.

TOP 3 PLAYERS HOLD ALMOST 60% OF THE MARKET

MANY KEY TECHNOLOGIES IN THE STARTING BLOCKS OF THIS INDUSTRY'S ROADMAP

KEY FEATURES OF THE REPORT

- 4 applications fields investigated (ESD/EMI protection, HB-LED ESD / TVS protection, RF and Digital & Mixed signal IPD)

- Market trends and figures provided both in $M, Munits and wafer size equivalent

- Technology roadmap and complete technologies and material tool-box analysis

- 30 detailed company profiles of key thin-film IPD players (320+ slides PPT)

This new study exhaustively lists the existing and upcoming technologies and applications for IPDs. The report describes the thin-film IPD market, growth opportunities and the associated technologies deep inside each application.

Each market sub-segment is exhaustively detailed with:

- Drivers and benefits of IPDs

- Sub-segment size and expected growth rate

- Value chain analysis

- Global market evaluation per application: volume in units, wafers, and market size ($).

- Evaluation of the major market players (market share)

- Key thin-film IPD product detailed teardown analysis

Key Topics Covered:

1. Objectives of the Study

2. Introduction, Definitions & Scope of the Report

3. Thin-Film IPD Applications and Market Drivers

4. Thin-Film IPD Market Status & 2011-2017 Forecasts