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TMCNet:  U.S. Patents Awarded to Inventors in Arizona (Jan. 18)

[January 18, 2013]

U.S. Patents Awarded to Inventors in Arizona (Jan. 18)

(Targeted News Service Via Acquire Media NewsEdge) Targeted News Service Targeted News Service ALEXANDRIA, Va., Jan. 18 -- The following federal patents were awarded to inventors in Arizona.

*** International Business Machines Assigned Patent ALEXANDRIA, Va., Jan. 18 -- International Business Machines, Armonk, N.Y., has been assigned a patent (8,355,345) developed by Daniel G. Eisenhauer, Austin, Texas, Roger G. Hathorn, Tucson, Ariz., and Louis W. Ricci, Poughkeepsie, N.Y., for an "apparatus, system, and method for establishing point to point connections in FCOE." The abstract of the patent published by the U.S. Patent and Trademark Office states: "An apparatus, system, and method are disclosed for establishing a point-to-point connection using Fibre Channel over Ethernet (FCoE). The point-to-point connection is established as part of the FCoE Initialization Protocol (FIP). A first computing device sends a FIP discovery solicitation to a predefined address such as ALL-FCF-MACs. The first computing device also listens to the local ALL-FCF-MACs address and determines whether or not there are any switches in the fabric connecting the first computing device and the second computing device. If there are no switches, the first computing device sends a second FIP discovery solicitation with a point-to-point indicator. If the first computing device receives a similar FIP discovery solicitation from the second computing device, it sends a FIP discovery advertisement with the point-to-point indicator. The first computing device and second computing device then perform fabric login and establish a point to point connection." The patent application was filed on Aug. 4, 2009 (12/535,465). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,355,345&OS=8,355,345&RS=8,355,345 Written by Satyaban Rath; edited by Hemanta Panigrahi.


*** Intel Assigned Patent ALEXANDRIA, Va., Jan. 18 -- Intel, Santa Clara, Calif., has been assigned a patent (8,354,748) developed by five co-inventors for an "in-package microelectronic apparatus, and methods of using same." The co-inventors are Sriram Dattaguru, Chandler, Ariz., Lesley A. Polka Wood, Chandler, Ariz., Yoshihiro Tomita, Tsukuba, Japan, Kiniya Ichikawa, Tsukuba, Japan, and Robert L. Sankman, Phoenix.

The abstract of the patent published by the U.S. Patent and Trademark Office states: "A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect and a microelectronic die is embedded in the mounting substrate. The microelectronic die is coupled to the processor interconnect and communication between a processor to be installed on the processor footprint is in a rate between 10 Gb/s and 1 Tb/s." The patent application was filed on Jan. 20, 2012 (13/354,708). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,354,748&OS=8,354,748&RS=8,354,748 Written by Arpi Sharma; edited by Anand Kumar.

*** Broadcom Assigned Patent for Method and System for Utilizing Context Data Tags to Catalog Data in Wireless System ALEXANDRIA, Va., Jan. 18 - Broadcom, Irvine, Calif., has been assigned a patent (8,355,706) developed by six co-inventors for a "method and system for utilizing context data tags to catalog data in wireless system." The co-inventors are Thomas Quigley, Franklin, N.C., Alexander G. MacInnis, Ann Arbor, Mich., Arya Behzad, Poway, Calif., Jeyhan Karaoguz, Irvine, Calif., John Walley, Ladera Ranch, Calif., and Mark Buer, Gilbert, Ariz.

The abstract of the patent published by the U.S. Patent and Trademark Office states: "A Wireless mobile communication (WMC) device may maintain user preference information, which is unique to the WMC device capabilities and the device user. The WMC device may modify and/or update the user preference information based on device use and information ascertained from applications running on the WMC device itself; for example scheduling applications. The user preference information may be utilized to create context data tags for generated data on the WMC device. Context data tags may comprise such information as time/date stamping, subject information, and/or location information. The context data tags may be utilized to tag the generated data, enabling continuous and improved cataloging. Improved cataloging may enable improved searchability of tagged data. Tagged data alternatively and/or additionally may be transferred and stored in a remote device for improved and secure back-up storage. The remote device may utilize context data tags for cataloging and storing received data." The patent application was filed on Jan. 2, 2008 (11/968,560). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,355,706.PN.&OS=PN/8,355,706&RS=PN/8,355,706 Written by Kusum Sangma; edited by Anand Kumar.

*** Amkor Technology Assigned Patent ALEXANDRIA, Va., Jan. 18 -- Amkor Technology, Chandler, Ariz., has been assigned a patent (8,354,747) developed by Bob Shih-Wei Kuo, Chandler, Ariz., for a "conductive polymer lid for a sensor package and method therefor." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A semiconductor device has a base substrate having a plurality of metal traces. A conductive polymer cover is provided having an opening. The conductive polymer cover forms a cavity when attached to the base substrate. At least one die is attached to an interior surface of the conductive polymer cover and positioned over the opening. The conductive polymer cover and the at least one die are electrically coupled to metal traces on the first surface of the base substrate." The patent application was filed on June 1, 2010 (12/791,472). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,354,747&OS=8,354,747&RS=8,354,747 Written by Arpi Sharma; edited by Anand Kumar.

*** Raytheon Assigned Patent ALEXANDRIA, Va., Jan. 18 -- Raytheon, Waltham, Mass., has been assigned a patent (8,354,627) developed by Robert W. Martin, Tucson, Ariz., for a "torsion stop deployment system for airborne object." The abstract of the patent published by the U.S. Patent and Trademark Office states: "Embodiments of a torsion stop deployment system for utilization onboard an airborne object are provided. In one embodiment, the torsion stop deployment system includes a deployable element hingedly coupled to the airborne object and rotatable from a non-deployed position to a deployed position. The torsion stop deployment system further includes a torsion bar member, which is fixedly coupled to the airborne object and which resiliently resists the rotation of the deployable element to reduce shock to the airborne object during deployment of the deployable element." The patent application was filed on Oct. 15, 2009 (12/579,970). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,354,627&OS=8,354,627&RS=8,354,627 Written by Arpi Sharma; edited by Anand Kumar.

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