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TMCNet:  Emcore Assigned Patent

[January 26, 2013]

Emcore Assigned Patent

(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Jan. 26 -- Emcore, Albuquerque, N.M., has been assigned a patent (8,357,556) developed by Richard Carson, Albuquerque, N.M., Elaine Taylor, Albuquerque, N.M., and Douglas Collins, Albuquerque, N.M., for a "method of protecting semiconductor chips from mechanical and ESD damage during handling." The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method and apparatus are provided for protecting a semiconductor device from damage. The method may include the steps of providing an active semiconductor device on a surface of a semiconductor substrate where the active device is surrounded by an inactive semiconductor area, and providing a soft metallic guard element in the inactive semiconductor area around at least a portion of the periphery of the active device wherein the metallic guard element is connected to ground potential and not to the active device." The patent application was filed on June 2, 2009 (12/476,895). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,357,556&OS=8,357,556&RS=8,357,556 Written by Satyaban Rath; edited by Hemanta Panigrahi.


SR0126HP0126-834712 (c) 2013 Targeted News Service

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