International Business Machines Assigned Patent for Implementing Loading and Heat Removal for Hub Module Assembly
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Feb. 1 -- International Business Machines, Armonk, N.Y., has been assigned a patent (8,363,404) developed by five co-inventors for an "implementing loading and heat removal for hub module assembly." The co-inventors are John L. Colbert, Byron, Minn., Jason R. Eagle, Kasson, Minn., Roger D. Hamilton, Rochester, Minn., Kenneth C. Marston, Poughquag, N.Y., and Steven P. Ostrander, Poughkeepsie, N.Y.
The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip."
The patent application was filed on Dec. 14, 2010 (12/967,854). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,363,404&OS=8,363,404&RS=8,363,404
Written by Satyaban Rath; edited by Hemanta Panigrahi.
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