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TMCNet:  Sensata Technologies Assigned Patent

[February 12, 2013]

Sensata Technologies Assigned Patent

(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Feb. 12 -- Sensata Technologies, Attleboro, Mass., has been assigned a patent (8,365,607) developed by Stephen E. Mitchell, Hope, R.I., and Juan P. Sanchez, Plainfield, Conn., for an "anti-slip grooves in a crimped pressure sensor assembly." The abstract of the patent published by the U.S. Patent and Trademark Office states: "According to one configuration, a base component of a pressure sensor assembly includes a hollowed volume (e.g., chamber, bore, space, etc.) in which to house components such as a pressure sensor element and pressure sensor circuitry. Opposite an opening to the hollowed volume, the base component further includes a port through which to receive a fluid. An inside wall of the first end of the metallic base component includes grooves. The grooves can be created on the inner wall based on a metalworking operation known as broaching. To produce the pressure sensor assembly, at least a portion of the first end of the metallic base component including the grooves is crimped inward to fixedly couple a connector component to the metallic base component and retain the pressure sensor electronics and pressure sensor circuitry within the hollowed volume." The patent application was filed on June 30, 2011 (13/172,996). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8,365,607&OS=8,365,607&RS=8,365,607 Written by Arpi Sharma; edited by Anand Kumar.


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