NexLogic Technologies Increases PCB Manufacturing Capacity By 25% and Adds New Capabilities
(PR Web Via Acquire Media NewsEdge) San Jose, CA (PRWEB) February 14, 2013
NexLogic Technologies, Inc., a leader in PCB design, fabrication, and assembly, is tracking the trend toward bringing manufacturing back to the United States. Accordingly, it has announced significantly greater manufacturing capacity and capability by adding a fifth assembly line including state of the art stencil printer, most modern pick and place machine, a package-on-package (PoP) dip unit, and a stencil cleaner.
The new equipment for the additional line increases NexLogic’s manufacturing capacity by an additional 25%. New equipment being added on NexLogic’s manufacturing floor are the Fuji XPF-W high-speed chip shooter and multi-purpose mounter, Speedline’s MPM 125 printer, a Fuji Dip Unit capable of producing accurate and massive scale package-on-package or PoP assemblies, and a new KED, Model KED-2000, RoHS-compliant stencil cleaner.
In addition to multiple applications capabilities, the Fuji and Speedline systems can handle large 20” X 27” boards such as device-under-test (DUT) and prober interface boards (PIBs). The Fuji model XPF-W is the second NexLogic has installed in its manufacturing facility within the last 12 months. The XPF-W not only serves as a high-speed chip shooter and multi-purpose mounter, but also as a dispensing machine. NexLogic manufacturing personnel use the XPF-W’s dynamic head exchange as a way to setup one line using the XPF-W, rather than using several different machines equipped with different functions.
Fuji America’s President, Nick Kimura, said, “NexLogic Technologies is one of our foremost customers in Silicon Valley. But even more important, NexLogic is a leading proponent of supporting its OEM customers with the most advanced equipment to provide them the best manufacturing solutions for their product lines.”
Speedline’s MPM 125 printer, the second major piece of equipment, is capable of performing highly accurate printing for extremely precise components. Its key features are ±12.5 micron placement at 6-sigma accuracy and repeatability. Plus, this printing system has a state-of-the art digital camera, which includes tele-centric lenses, advanced optics, and lighting techniques. As a result, high quality vision performance is achieved in both alignment and post-print inspection.
Zulki Khan, President of NexLogic Technologies, said, “Our new fifth line with this leading-edge technology manufacturing equipment assures our customers of the sustained and robust increased production capabilities and required capacity we’ve strongly maintained over time. We are well positioned to undertake the most advanced board technologies and bring these OEM customer orders to a highly acceptable completion.”
The new Fuji NXT II dip unit is used on the NexLogic manufacturing floor to precisely place PoP (package on package) devices. Fully automated, the dip unit verifies the amount of required flux or solder and deposits the same amount of paste or tacky flux to uniformly adhere to every BGA ball for PoP placement.
The new stencil cleaner provides NexLogic manufacturing an even more detailed manner of assuring that residue flux and solder paste is eliminated from the stencil after printing is done. This approach is especially critical for PCBs populated with small packaged devices such as microBGAs and PoP. Plus, the stencil cleaner eliminates the need for manual cleaning, which often leads to warpage or stencil damage over time.
About NexLogic Technologies, Inc.
1995-2013 18th Anniversary year
An ISO 9001:2008, ISO 13485 Certified, and RoHS compliant EMS provider, NexLogic is a leading electronic manufacturing services provider that offers total integrated circuit board solutions. The company was established in 1995 and serves over 100 customers in North America. NexLogic’s mission is to be the best electronic manufacturing services (EMS) provider to the markets it serves through high quality and an efficient manufacturing process.
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