Tessera Assigned Patent
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Aug. 26 -- Tessera, San Jose, Calif., has been assigned a patent (8,512,491) developed by five co-inventors for a "dual wafer spin coating." The co-inventors are Vage Oganesian, Palo Alto, Calif., Belgacem Haba, Saratoga, Calif., Ilyas Mohammed, Santa Clara, Calif., Piyush Savalia, Santa Clara, Calif., and Craig Mitchell, San Jose, Calif.
The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method of bonding a first substrate and a second substrate includes the steps of rotating first substrate with an adhesive mass thereon, and second substrate contacting the mass and overlying the first substrate, controlling a vertical height of a heated control platen spaced apart from and not contacting the second substrate so as to control a temperature of the adhesive mass, so as to at least one of bond the first and second substrates in alignment with one another, or achieve a sufficiently planar adhesive interface between the first and second substrates."
The patent application was filed on Dec. 21, 2010 (12/974,611). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8512491.PN.&OS=PN/8512491&RS=PN/8512491
Written by Sudarshan Harpal; edited by Jaya Anand.
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