International Business Machines Assigned Patent for Through Wafer Vias and Method of Making Same
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Aug. 30 -- International Business Machines, Armonk, N.Y., has been assigned a patent (8,518,787) developed by Hanyi Ding, Essex Junction, Vt., Alvin Jose Joseph, Williston, Vt., and Anthony Kendall Stamper, Williston, Vt., for a "through wafer vias and method of making same."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method of forming and structure for through wafer vias and signal transmission lines formed of through wafer vias. The method of forming through wafer vias includes forming an array of through wafer vias comprising at least one electrically conductive through wafer via and at least one electrically non-conductive through wafer via through a semiconductor substrate having a top surface and an opposite bottom surface, each through wafer via of the array of through wafer vias extending from the top surface of the substrate to the bottom surface of the substrate."
The patent application was filed on Sept. 6, 2012 (13/604,731). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=85,18,787.PN.&OS=PN/85,18,787&RS=PN/85,18,787
Written by Amal Ahmed; edited by Jaya Anand.
(c) 2013 Targeted News Service
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