3M Innovative Properties Assigned Patent
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Aug. 30 -- 3M Innovative Properties, Saint Paul, Minn., has been assigned a patent (8,518,805) developed by Kwang-Jae Jo, Seoul, South Korea, and Kyung-Ho Jang, Gyeonggi-do, South Korea, for a "method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "Disclosed is a method for dicing a semiconductor wafer. The method for dicing a semiconductor wafer prevents a die from being contaminated with silicon dust, generated during the dicing of the wafer, and thus prevents defects in a subsequent wire bonding step, such as defects in bonding wire, contamination of a semiconductor device, etc. The method for dicing a semiconductor wafer comprises the steps of: applying a fluorine-containing polymer coating agent onto one surface of a wafer having a circuit pattern formed thereon to form a polymer coating layer, before dicing the wafer."
The patent application was filed on Aug. 21, 2008 (12/672,899). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=85,18,805.PN.&OS=PN/85,18,805&RS=PN/85,18,805
Written by Amal Ahmed; edited by Jaya Anand.
(c) 2013 Targeted News Service
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