Qualcomm Assigned Patent
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Sept. 21 -- Qualcomm, San Diego, has been assigned a patent (8,536,678) developed by Matthew Michael Nowak, San Diego, and Shiqun Gu, San Diego, for a "through substrate via with embedded decoupling capacitor."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method of manufacturing a semiconductor die having a substrate with a front side and a back side includes fabricating openings for through substrate vias on the front side of the semiconductor die. The method also includes depositing a first conductor in the through substrate vias, depositing a dielectric on the first conductor and depositing a second conductor on the dielectric. The method further includes depositing a protective insulator layer on the back side of the substrate covering the through substrate vias."
The patent application was filed on Oct. 17, 2012 (13/654,245). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8536678.PN.&OS=PN/8536678&RS=PN/8536678
Written by Deviprasad Jena; edited by Jaya Anand.
(c) 2013 Targeted News Service
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