Freescale Semiconductor Assigned Patent
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Sept. 21 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,536,684) developed by Wei Min Chen, Tianjin, China, Zhigang Bai, Tianjin, China, and Zhijie Wang, Tianjin, China, for a "method of assembling shielded integrated circuit device."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method of assembling an integrated circuit (IC) device includes the steps of providing a lead frame or substrate panel, attaching a semiconductor die to the lead frame or substrate panel and electrically coupling the die to the lead frame or substrate panel. The method further includes encapsulating the die with a first encapsulant, and the encapsulating the first encapsulant with a second encapsulant where the second encapsulant includes a material that provides electromagnetic shielding."
The patent application was filed on April 22, 2011 (13/092,162). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8536684.PN.&OS=PN/8536684&RS=PN/8536684
Written by Deviprasad Jena; edited by Jaya Anand.
(c) 2013 Targeted News Service
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