Xilinx Assigned Patent
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Sept. 21 -- Xilinx, San Jose, Calif., has been assigned a patent (8,536,717) developed by Shin S. Low, Cupertino, Calif., and Inderjit Singh, Saratoga, Calif., for an "integrated circuit package and method of assembling an integrated circuit package."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "A method of assembling an integrated circuit package is disclosed. The method comprises placing a die on a substrate of the integrated circuit package; coupling a plurality of wire bonds from a plurality of bond pads on the die to corresponding bond pads on the substrate; applying a non-conductive material to the plurality of wire bonds; and encapsulating the die and the plurality of wire bonds. An integrated circuit package is also disclosed."
The patent application was filed on Jan. 10, 2012 (13/347,327). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8536717.PN.&OS=PN/8536717&RS=PN/8536717
Written by Deviprasad Jena; edited by Jaya Anand.
(c) 2013 Targeted News Service
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