Xilinx Assigned Patent for Configuration of a Multi-die Integrated Circuit
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Sept. 21 -- Xilinx, San Jose, Calif., has been assigned a patent (8,536,895) developed by six co-inventors for a "configuration of a multi-die integrated circuit." The co-inventors are Weiguang Lu, San Jose, Calif., Eric E. Edwards, Albuquerque, N.M., Paul-Hugo Lamarche, San Jose, Calif., Steven P. Young, Boulder, Colo., Brian C. Gaide, Glassboro, N.J., and Joe Eddie Leyba II, Albuquerque, N.M.
The abstract of the patent published by the U.S. Patent and Trademark Office states: "An embodiment of an integrated circuit (IC) is described. This embodiment of the IC includes an interposer; a first die on an interposer, where the first die generates a global signal propagated through the interposer; and a second die on the surface of the interposer and coupled to the global signal. The first die and the second die each is configured to implement a same operating state concurrently in response to the global signal."
The patent application was filed on Sept. 30, 2011 (13/251,171). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8536895.PN.&OS=PN/8536895&RS=PN/8536895
Written by Sudarshan Harpal; edited by Jaya Anand.
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