Semiconductor Components Industries Assigned Patent
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Sept. 21 -- Semiconductor Components Industries, Phoenix, has been assigned a patent (8,536,685) developed by Hormazdyar M. Dalal, Lagrangeville, N.Y., and Jagdish Prasad, Pocatello, Idaho, for a "shielded semiconductor device structure."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "In one embodiment, a semiconductor device is formed to include a plurality of conductor layers that interconnect electrical signals between semiconductor elements of the semiconductor device. A metal shield layer is formed overlying a portion of the plurality of conductor layers. A signal re-distribution layer is formed overlying the metal shield layer."
The patent application was filed on Jan. 24, 2012 (13/357,187). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8536685.PN.&OS=PN/8536685&RS=PN/8536685
Written by Deviprasad Jena; edited by Jaya Anand.
(c) 2013 Targeted News Service
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