International Business Machines Assigned Patent for Electrode Arrays and Methods of Fabricating the Same Using Printing Plates to Arrange Particles...
(Targeted News Service Via Acquire Media NewsEdge) International Business Machines Assigned Patent for Electrode Arrays and Methods of Fabricating the Same Using Printing Plates to Arrange Particles in an Array
By Targeted News Service
ALEXANDRIA, Va., Oct. 7 -- International Business Machines, Armonk, N.Y., has been assigned a patent (8,546,257) developed by Tobias Kraus, Saarbruecken, Germany, Laurent Malaquin, Linas, France, and Heiko Wolf, Pfaeffikon, Switzerland, for "electrode arrays and methods of fabricating the same using printing plates to arrange particles in an array."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "Electrode arrays and methods of fabricating the same using a printing plate to arrange conductive particles in alignment with an array of electrodes are provided. In one embodiment, a semiconductor device comprises: a semiconductor topography comprising an array of electrodes disposed upon a semiconductor substrate; a dielectric layer residing upon the semiconductor topography; and at least one conductive particle disposed in or on the dielectric layer in alignment with at least one of the array of electrodes."
The patent application was filed on July 17, 2012 (13/551,159). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8546257.PN.&OS=PN/8546257&RS=PN/8546257
Written by Sudarshan Harpal; edited by Jaya Anand.
(c) 2013 Targeted News Service
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