International Business Machines Assigned Patent for Self-aligned Polymer Passivation/aluminum pad
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Oct. 7 -- International Business Machines, Armonk, N.Y., has been assigned a patent (8,546,253) developed by five co-inventors for a "self-aligned polymer passivation/aluminum pad." The co-inventors are Timothy H. Daubenspeck, Colchester, Vt., Jeffrey P. Gambino, Westford, Vt., Christopher D. Muzzy, Burlington, Vt., Wolfgang Sauter, Hinesburg, Vt., and Timothy D. Sullivan, Underhill, Vt.
The abstract of the patent published by the U.S. Patent and Trademark Office states: "The invention provides a semiconductor chip structure having at least one aluminum pad structure and a polyimide buffering layer under the aluminum pad structure, wherein the polyimide buffering layer is self-aligned to the aluminum pad structure, and a method of forming the same. The method includes forming a polyimide buffering layer on a substrate, forming an aluminum pad structure on the buffering layer, and, using the aluminum pad structure as a mask, etching the substrate to remove the polyimide buffering layer from the substrate everywhere except under the aluminum pad structure."
The patent application was filed on March 9, 2012 (13/415,902). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8546253.PN.&OS=PN/8546253&RS=PN/8546253
Written by Sudarshan Harpal; edited by Jaya Anand.
(c) 2013 Targeted News Service
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