International Business Machines Assigned Patent for Flexible Fiber to Wafer Interface
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Oct. 8 -- International Business Machines, Armonk, N.Y., has been assigned a patent (8,545,108) developed by Tymon Barwicz, Yorktown Heights, N.Y., Hidetoshi Numata, Sagamihara, Japan, and Yoichi Taira, Tokyo, for a "flexible fiber to wafer interface."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "A fiber to wafer interface system includes an interface device comprising a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule, a wafer portion comprising a single mode waveguide portion arranged on a portion of the wafer, an adhesive disposed between a portion of the single mode waveguide portion of the body portion and the single mode waveguide portion of the wafer portion, the adhesive securing the body portion to the wafer portion."
The patent application was filed on April 23, 2012 (13/453,027). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8545108.PN.&OS=PN/8545108&RS=PN/8545108
Written by Sudarshan Harpal; edited by Jaya Anand.
(c) 2013 Targeted News Service
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