QUALCOMM Assigned Patent for Semiconductor Wafer-to-wafer Bonding
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Oct. 23 -- QUALCOMM, San Diego, has been assigned a patent (8,557,680) developed by two co-inventors for a "[s]emiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers." The co-inventors are Arvind Chandrasekaran, San Diego, and Brian M. Henderson, San Diego.
The patent application was filed on July 10, 2012 (13/545,393). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8557680.PN.&OS=PN/8557680&RS=PN/8557680
Written by Jude Bautista; edited by Marlyn Vitin.
(c) 2013 Targeted News Service
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