|[December 08, 2013]
CEA-Leti Signs Agreement with Qualcomm to Assess Sequential 3D Technology
WASHINGTON --(Business Wire)--
CEA-Leti today announced an agreement with Qualcomm (News - Alert) Technologies, Inc.,
a subsidiary of Qualcomm Incorporated, to assess the feasibility and the
value of Leti's sequential 3D technology.
In recent years, Leti has been actively working on a new 3D integration
technology process called sequential 3D integration that enables the
stacking of active layers of transistors in the third dimension. In
comparison with 3D-TSV technologies, advantageously used to stack
separate die, sequential 3D technology is anticipated to process all the
functions in a single semiconductor manufacturing flow. Thus, the
technology allows connecting active areas at the transistor level, at a
very high density as it uses a standard lithography process to align
According to Leti experts, this new technology is expected to allow a 50
percent gain in area and a 30 percent gain in speed compared to the same
generation of technology made n classical 2D. These gains are
comparable to those expected in next-generation 2D technology, but the
sequential 3D technology is expected to be much less complex and
expensive to implement, making this technology a potential alternative
to conventional planar scaling solutions.
Leti has shown a number of significant technical advances in sequential
3D technology. The arrangement between Leti and Qualcomm Technologies
will allow the critical assessment of this technology in the context of
practical applications, further evaluating the potential impact of this
sequential 3D technology for future industrialization.
By creating innovation and transferring it to industry, Leti is the
bridge between basic research and production of micro- and
nanotechnologies that improve the lives of people around the world.
Backed by its portfolio of 2,200 patents, Leti partners with large
industrials, SMEs and startups to tailor advanced solutions that
strengthen their competitive positions. It has launched more than 50
startups. Its 8,000m² of new-generation cleanroom space feature 200mm
and 300mm wafer processing of micro and nano solutions for applications
ranging from space to smart devices.
Qualcomm is a trademark, registered in the US and other countries.
All Qualcomm Incorporated trademarks are used with permission. Other
product and brand names may be trademarks or registered trademarks of
their respective owners.
[ Back To Technology News's Homepage ]