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TMCNet:  Research and Markets: Shipment Value of the Taiwanese IC Packaging and Testing Industry Continued to Expand in the Third Quarter of 2013

[January 14, 2014]

Research and Markets: Shipment Value of the Taiwanese IC Packaging and Testing Industry Continued to Expand in the Third Quarter of 2013

DUBLIN --(Business Wire)--

Research and Markets (http://www.researchandmarkets.com/research/hjdgvg/taiwanese_ic) has announced the addition of the "Taiwanese IC Packaging & Testing Industry, 4Q 2013" report to their offering.

This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that shipment value of the Taiwanese IC packaging and testing industry continued to expand in the third quarter of 2013, registering a 5.0% sequential groth to around US$3.27 billion. However, the industry's shipment value is expected to slip 3.4% sequentially to around US$3.16 billion in the fourth quarter.


Companies Mentioned:

- Ardentec

- ASE

- Chipbond

- ChipMOS

- FATC

- KYEC

- OSE

- PTI

- Sigurd

- SPIL

- Walton

Key Topics Covered:

Taiwanese IC Packaging and Testing Industry Shipment Value, 2Q 2011 - 1Q 2014

Taiwanese IC Testing Industry Shipment Value , 2Q 2011 - 1Q 2014

Taiwanese IC Packaging Industry's Shipment Value Rankings, 2Q 2011 - 3Q 2013

Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 2Q 2011 - 3Q 2013

Taiwanese IC Testing Industry's Shipment Value Rankings, 2Q 2011 - 3Q 2013

Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 2Q 2011 - 3Q 2013

Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 2Q 2011 - 3Q 2013

Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 2Q 2011 - 3Q 2013

Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 2Q 2011 - 3Q 2013

Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 2Q 2011 - 3Q 2013

For more information visit http://www.researchandmarkets.com/research/hjdgvg/taiwanese_ic

About Research and Markets

Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.


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