Freescale Semiconductor Assigned Patent for Encapsulant for Semiconductor Device
(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service
ALEXANDRIA, Va., Feb. 7 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,643,197) developed by four co-inventors for "encapsulant for a semiconductor device." The co-inventors are Sheila F. Chopin, Round Rock, Texas, Varughese Mathew, Austin, Texas, Leo M. Higgins III, Austin, Texas, and Chu-Chung Lee, Round Rock, Texas.
The patent application was filed on Oct. 15, 2012 (13/651,995). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=3&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=101&f=G&l=50&co1=AND&d=PTXT&s1=20140204.PD.&s2=%28TX.ASST.%29&OS=ISD/02/04/2014+AND+AS/TX&RS=ISD/02/04/2014+AND+AS/TX
Written by Balkishan Dalai; edited by Jaya Anand.
(c) 2014 Targeted News Service
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