SUBSCRIBE TO TMCnet
TMCnet - World's Largest Communications and Technology Community

TMCNet:  Freescale Semiconductor Assigned Patent for Encapsulant for Semiconductor Device

[February 07, 2014]

Freescale Semiconductor Assigned Patent for Encapsulant for Semiconductor Device

(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Feb. 7 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,643,197) developed by four co-inventors for "encapsulant for a semiconductor device." The co-inventors are Sheila F. Chopin, Round Rock, Texas, Varughese Mathew, Austin, Texas, Leo M. Higgins III, Austin, Texas, and Chu-Chung Lee, Round Rock, Texas.


The patent application was filed on Oct. 15, 2012 (13/651,995). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=3&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=101&f=G&l=50&co1=AND&d=PTXT&s1=20140204.PD.&s2=%28TX.ASST.%29&OS=ISD/02/04/2014+AND+AS/TX&RS=ISD/02/04/2014+AND+AS/TX Written by Balkishan Dalai; edited by Jaya Anand.

BD0207JA0207-976592 (c) 2014 Targeted News Service

[ Back To Technology News's Homepage ]

OTHER NEWS PROVIDERS







Technology Marketing Corporation

800 Connecticut Ave, 1st Floor East, Norwalk, CT 06854 USA
Ph: 800-243-6002, 203-852-6800
Fx: 203-866-3326

General comments: tmc@tmcnet.com.
Comments about this site: webmaster@tmcnet.com.

STAY CURRENT YOUR WAY

© 2014 Technology Marketing Corporation. All rights reserved.