[February 11, 2014]

Interlink Electronics, Inc. Announces a New Addition to the Executive Team and the Establishment of its Subsidiary in the United Kingdom

Interlink (News - Alert) Electronics, Inc. (OTC: LINK), a global leader in sensor and human-machine interface technologies, today announced the establishment of a wholly-owned subsidiary named Interlink Electronics Europe Limited, which was incorporated in the United Kingdom on January 31, 2014. Interlink Electronics Europe Limited will serve as our European regional sales office and the base for our new Vice President of Global Sales and Business Development. Additionally, Interlink Electronics is proud to announce that Neil Jarvie will join the Company on May 5, 2014 in the role of Vice President of Global Sales and Business Development. Neil Jarvie will report to Dr. Howard Goldberg, the President and COO of Interlink Electronics.

Neil Jarvie comes to Interlink Electronics with over 20 years of experience in high-technology sales and strategic account management. Since 2011, Mr. Jarvie has been the Vice President of Sales at Peratech Limited, a global R&D innovator and intellectual property licensor of touch-sensor materials used in human-machine interface applications. At Peratech, Mr. Jarvie defined and established a "go-to-market" strategy, process, and systems that resulted in significant increases in R&D development and licensing revenues. Prior to Peratech, Mr. Jarvie had spent 12 years at Cypress Semiconductor as the Global Account Manager, where he drove significant revenue growth multiples in the sale of capacitive touch controller products to leading mobile device manufacturers. In 2008, Mr. Jarvie was the recipient of the Cypress "Salesperson of the Year Award." Mr. Jarvie had also held sales and account management roles of increasing responsibility at Rohm Electronics and Murata Electronics, where his accomplishments include establishing a regional sales office and quadrupling sales in just 24 months. Mr. Jarvie studied electrical and electronic engineering at Newcastle Polytechnic (Northumbria University) in Newcastle, UK, and he was sponsored by GEC Plessey Telecommunications.

"Interlink Electronics is excited to have as eil Jarvie join our executive team as he offers a unique blend of hands-on and seasoned sales leadership that has resulted in the successful establishment of sales organizations and new revenue growth, while servicing a global, high-tech Fortune-500 customer base. Neil's deep understanding of finding successful commercial solutions and new application domains in the human-machine interface market aligns well with the future growth initiatives of Interlink Electronics," stated Howard D. Goldberg, Ph.D., President and COO of Interlink Electronics. Dr. Goldberg continued, "Our new sales office in the UK allows us to fully leverage the inherent synergies in the strategic geographic triangle of USA, UK, and Asia. Additionally, the UK has a relevant history in human-machine interface materials and product innovation that dates back to the development of trackball devices used for WWII radar control."

About Interlink Electronics, Inc.

Interlink Electronics is a world-leading trusted advisor and technology partner in the advancing world of touch-sensor and human-machine interface technologies. Interlink Electronics has led the printed electronics industry in the commercialization of its patented Force-Sensing Resistor (FSR®) technology, which has enabled rugged and reliable human-machine interface ("HMI") solutions. For over 29 years, Interlink Electronics' solutions have focused on handheld user input, menu navigation, cursor control, and other intuitive interface technologies for the world's top electronics manufacturers. Interlink Electronics has a proven track record of supplying human-machine interface solutions for mission-critical applications in a wide range of markets, including, but not limited to, consumer electronics, automotive, industrial, and medical devices. Interlink Electronics serves a world-class customer-base from its corporate headquarters in Camarillo, California (greater Los Angeles area), state-of-the-art printed-electronics factory in China, global distribution and warehouse facility in Hong Kong, and offices in the United Kingdom, Japan and Singapore. For more information, please see http://www.interlinkelectronics.com.

FORWARD-LOOKING STATEMENTS: This release contains "forward-looking statements" involving a number of risks and uncertainties as defined in the Private Securities Litigation Reform Act of 1995. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: historical losses and negative cash flow, the success of business divestitures and acquisitions, the ownership of the majority of our stock by a small group of investors, our success in predicting new markets and the acceptance of our new products, efficient management of our infrastructure, the pace of technological developments and industry standards evolution and their effect on our target product and market choices, the effect of outsourcing technology development, changes in the ordering patterns of our customers, a decrease in the quality and/or reliability of our products, protection of our proprietary intellectual property, competition by alternative sophisticated as well as generic products, pending litigation against Interlink Electronics, historical weaknesses in internal controls over financial reporting, continued availability of raw materials for our products at competitive prices, disruptions in our manufacturing facilities, risks of international sales and operations including fluctuations in exchange rates, compliance with regulatory requirements applicable to our manufacturing operations, and customer concentrations. The forward-looking statements contained in this release should be considered in light of these risk factors.

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