SUBSCRIBE TO TMCnet
TMCnet - World's Largest Communications and Technology Community

TMCNet:  Research and Markets: Bosch Sensortec BMC150 6-Axis MEMS eCompass Technology Report

[March 13, 2014]

Research and Markets: Bosch Sensortec BMC150 6-Axis MEMS eCompass Technology Report

DUBLIN --(Business Wire)--

Research and Markets (http://www.researchandmarkets.com/research/vnmlz9/bosch_sensortec) has announced the addition of the "Bosch Sensortec BMC150 6-Axis MEMS eCompass Technology Report" report to their offering.

The BMC150 combines a 12-bit 3-Axis (News - Alert) accelerometer and a wide-range 3-Axis geomagnetic sensor in a 2.2x2.2mm LGA package (the smallest footprint at its introduction). All the functionalities are developed and manufactured by Bosch.

Compared to its predecessor BMC050, the BMC150 achieve almost 50% footprint reduction. This reduction has been made possible by the integration of the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation.

The magnetic sensor still uses Bosch FlipCore technology for X/Y-Axis sensing and Hall element for Z-Axis sensing. TheMEMS accelerometer is also an evolution of the one found in BMC050.


The BMC150 is a very low power (190µA) and high resolution (0.3µT) 6-axis digital compass targeted for consumer mobile applications.

Key Topics Covered

Physical Analysis

- Package

-- Package Views, Dimensions & X-Ray

-- Package Opening

-- Wire bonding Process

-- Package Cross-Section

- Accelerometer ASIC Die

-- View, Dimensions & Marking

-- Process Identification

-- Cross-Section

- Accelerometer MEMS Die

-- View, Dimensions & Marking

-- Bond Pad Opening & Bond Pad

-- Cap Removed & Cap Details

-- Sensing Area Details

-- Cross-Section (Sensor, Cap & Bonding)

-- Process Characteristics

- Magnetometer Die

-- View, Dimensions & Marking

-- Hall sensor and fluxgate sensors

-- Delayering

-- Main Blocks Identification

-- Cross-Section (CMOS & Sensor)

Manufacturing Process Flow

-- ASIC Accelero Front-End Process

-- MEMS Accelero Process Flow

-- Magnetometer Process Flow

-- Wafer Fabrication Unit

-- Packaging Process Flow

-- Package Assembly Unit

The Technology Analysis report contains only Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis report is also available. For more information visit http://www.researchandmarkets.com/research/vnmlz9/bosch_sensortec

About Research and Markets

Research and Markets is the world's leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products.


[ Back To Technology News's Homepage ]

OTHER NEWS PROVIDERS







Technology Marketing Corporation

800 Connecticut Ave, 1st Floor East, Norwalk, CT 06854 USA
Ph: 800-243-6002, 203-852-6800
Fx: 203-866-3326

General comments: tmc@tmcnet.com.
Comments about this site: webmaster@tmcnet.com.

STAY CURRENT YOUR WAY

© 2014 Technology Marketing Corporation. All rights reserved.