[March 13, 2014]

Research and Markets: Bosch Sensortec BMC150 6-Axis MEMS eCompass Technology Report

Research and Markets (http://www.researchandmarkets.com/research/vnmlz9/bosch_sensortec) has announced the addition of the "Bosch Sensortec BMC150 6-Axis MEMS eCompass Technology Report" report to their offering.

The BMC150 combines a 12-bit 3-Axis (News - Alert) accelerometer and a wide-range 3-Axis geomagnetic sensor in a 2.2x2.2mm LGA package (the smallest footprint at its introduction). All the functionalities are developed and manufactured by Bosch.

Compared to its predecessor BMC050, the BMC150 achieve almost 50% footprint reduction. This reduction has been made possible by the integration of the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation.

The magnetic sensor still uses Bosch FlipCore technology for X/Y-Axis sensing and Hall element for Z-Axis sensing. TheMEMS accelerometer is also an evolution of the one found in BMC050.

The BMC150 is a very low power (190µA) and high resolution (0.3µT) 6-axis digital compass targeted for consumer mobile applications.

Key Topics Covered

Physical Analysis

- Package

-- Package Views, Dimensions & X-Ray

-- Package Opening

-- Wire bonding Process

-- Package Cross-Section

- Accelerometer ASIC Die

-- View, Dimensions & Marking

-- Process Identification

-- Cross-Section

- Accelerometer MEMS Die

-- View, Dimensions & Marking

-- Bond Pad Opening & Bond Pad

-- Cap Removed & Cap Details

-- Sensing Area Details

-- Cross-Section (Sensor, Cap & Bonding)

-- Process Characteristics

- Magnetometer Die

-- View, Dimensions & Marking

-- Hall sensor and fluxgate sensors

-- Delayering

-- Main Blocks Identification

-- Cross-Section (CMOS & Sensor)

Manufacturing Process Flow

-- ASIC Accelero Front-End Process

-- MEMS Accelero Process Flow

-- Magnetometer Process Flow

-- Wafer Fabrication Unit

-- Packaging Process Flow

-- Package Assembly Unit

The Technology Analysis report contains only Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis report is also available. For more information visit http://www.researchandmarkets.com/research/vnmlz9/bosch_sensortec

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