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TMCNet:  3D IC and TSV Interconnect Market Worth $6.55 billion by 2016 - Report by MarketsandMarkets

[March 23, 2014]

3D IC and TSV Interconnect Market Worth $6.55 billion by 2016 - Report by MarketsandMarkets

(PR Web Via Acquire Media NewsEdge) (PRWEB) March 23, 2014 According to a new market research report "Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, LED, Sensor, MEMS, Power & Analog Components) & Applications (Mobile Devices, Processors, ICT, Networking, Automotive, Defense)", the total 3D IC market is expected to reach $6.55 billion by 2016 at a CAGR of 16.9% from 2011 to 2016.


Browse 30 tables and in-depth TOC on 3D IC Chip and TSV Interconnect Market – Global Forecast and Analysis (2011-2016).

http://www.marketsandmarkets.com/Market-Reports/3D-IC-Chip-and-TSV-Interconnect-Market-117.html Purchase now@ http://www.marketsandmarkets.com/Purchase/purchase_report1.asp?id=117 The transition from 2 dimensional (2D) packaging to 3D packaging is considered to be one of the major developments in the semiconductor industry. 3D packaging is observed to pave way for the concept of "More than Moore" with comparatively lesser investment. This has led to strategic innovation with respect to 3D integration despite the economic downturn. The use of TSV interconnects within die stack instead of wire bond interconnect and board-level routing helps to save the system energy consumption to a large extent. Some of the early innovations related to TSV include that from Samsung (South Korea) and Xilinx (U.S.).

The two categories of substrates used in the production of 3D ICs include silicon on insulator (SOI) and bulk silicon. High cost is observed to be the key factor hindering the adoption of SOI wafer on a large scale. The different bonding techniques employed include die to die, die to wafer, wafer to wafer, direct bonding, adhesive bonding, and metallic bonding. The yield achieved in wafer to wafer process is generally below 85% due to Known Good Die (KGD) issues and is thus observed to be cost prohibitive. In direct bonding, the wafers can be bonded at room temperature. This, in turn, helps to eliminate the problem of misalignment, which arises due to thermal expansion of one wafer relative to the other at the time of bond reaction. With respect to process realization techniques, it is believed that wafer to wafer and via middle processes will become the preferred standard for volume production of 3D ICs mainly due to the reduced cost of the end-product. On the other hand, via last approach can be performed with the currently available infrastructure and hence they are expected to open the path to better market adoption for 3D integration.

Early buyers will receive 10% customization of report.

http://www.marketsandmarkets.com/requestCustomization.asp?id=117 Amongst the various end-products for 3D ICs and TSV interconnects, memories are observed to be the most potential product market with a market share of approximately 40%. This is followed by sensors and in particular, image sensors. Consumer electronics application sector is observed to hold the largest share in 3D ICs and TSV interconnects market with high demand for it in a number of end-products such as smartphones, tablet PCs, e-readers, laptops, and more.

The global 3D IC market is expected to grow from $2.21 billion in 2009 to $6.55 billion in 2016 at a CAGR of 16.9% from 2011 to 2016. Asian region is observed to have the highest growth rate. This is mainly attributed to the presence of a huge number of companies such as Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung (South Korea), United Microelectronics Corporation (Taiwan), and more who contribute to different aspects of 3D IC manufacturing and thus help to address the challenges associated with its manufacture in a cost effective manner.

Browse Related Reports: Photonic Integrated Circuit (IC) & Quantum Computing Market (2012 – 2022): By Application (Optical Fiber Communication, Optical Fiber Sensors, Biomedical); Components (Lasers, Attenuators); Raw Materials (Silica on Silicon, Silicon on Insulator) http://www.marketsandmarkets.com/Market-Reports/photonic-integrated-circuit-ic-optical-computing-chip-market-881.html Global Mixed Signal System-on-Chip (MxSoC) Market by Intellectual Property (IP), Design Architecture, Fabrication Technology, Processor Type, Technology Nodes & Applications 2011 - 2016 http://www.marketsandmarkets.com/Market-Reports/system-on-chip-market-444.html About MarketsandMarkets MarketsandMarkets is a global market research and consulting company based in the U.S. We publish strategically analyzed market research reports and serve as a business intelligence partner to Fortune 500 companies across the world.

MarketsandMarkets also provides multi-client reports, company profiles, databases, and custom research services. They cover thirteen industry verticals, including advanced materials, automotive and transportation, banking and financial services, biotechnology, chemicals, consumer goods, energy and power, food and beverages, industrial automation, medical devices, pharmaceuticals, semiconductor and electronics, and telecommunications and IT.

We at MarketsandMarkets are inspired to help our clients grow by providing apt business insight with our huge market intelligence repository. To know more about us and our reports, please visit our website.

Contact: Mr. Rohan North - Dominion Plaza, 17304 Preston Road, Suite 800, Dallas, TX 75252 Tel: +1-888-600-6441 Email: sales(at)marketsandmarkets(dot)com Visit MarketsandMarkets Blog @ http://www.marketsandmarketsblog.com/market-reports/electronics-and-semiconductors Read the full story at http://www.prweb.com/releases/3D-IC-Chip-and-TSV/Interconnect-Market/prweb11688118.htm (c) 2014 PRWEB.COM Newswire

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