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TMCNet:  Research and Markets: Sensonor STIM210 - High-precision MEMS Gyro Module Reverse Costing Report with Complete Teardown Analysis

[April 08, 2014]

Research and Markets: Sensonor STIM210 - High-precision MEMS Gyro Module Reverse Costing Report with Complete Teardown Analysis

DUBLIN --(Business Wire)--

Research and Markets (http://www.researchandmarkets.com/research/7bt7jx/sensonor_stim210) has announced the addition of the "Sensonor STIM210 - High-precision MEMS Gyro Module Reverse Costing Analysis" report to their offering.

MEMS gyroscopes for tactical grade applications made a lot of progress in the past few years in term of reliability. They are now accepted in high-reliability environments, and are even starting to replace FOGs and other technologies in tactical applications.

With a bias instability of 0.5°/h, the Sensonor STIM210 is the world highest performance silicon MEMS gyroscope. The module is available without export control (ITAR-free). The analyzed module is a complete system offering 3 axes MEMS gyros associated with a 32-bit microcontroller which proides flexibility in device configuration.


STIM210 applications are typically found within Industrial, Aerospace and Defense markets, for various platform stabilizations, pointing and navigation systems, attitude heading reference systems (AHRSs), inertial navigation systems (INSs), smart munitions, missiles, 3D mapping systems, range finders, trains, robotics, and more. For many applications STIM210 directly replaces FOGs and improves system solutions with respect to robustness, reliability, size, weight, power and cost.

COMPLETE TEARDOWN WITH:

  • Detailed Photos
  • BOM Identification
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation

Key Topics Covered:

1. Glossary

2. Overview/Introduction

3. Company Profile

4. Physical Analysis

  • Module
  • Electronic Board
  • ASICs
  • MEMS Gyro

5. Manufacturing Process Flow

  • Global Overview
  • ASICs Front-End Processes & Wafer Fab Units
  • MEMS Process Flow & Wafer Fab Unit
  • Module Assembly Process Flow & Assembly Unit

6. Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASICs Cost
  • MEMS Gyro Cost
  • Electronic Board BOM Cost
  • Module Assembly & Test Cost
  • STIM210 Module Cost & Estimated Price

Visit http://www.researchandmarkets.com/research/7bt7jx/sensonor_stim210


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