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TMCNet:  Amkor Technology to Present at Barclays High Yield Bond and Syndicated Loan Conference

[May 07, 2014]

Amkor Technology to Present at Barclays High Yield Bond and Syndicated Loan Conference

CHANDLER, Ariz. --(Business Wire)--

Amkor (News - Alert) Technology, Inc. (Nasdaq: AMKR) today announced that it will participate in the Barclays High Yield Bond and Syndicated Loan Conference on Tuesday, May 13, 2014. Amkor's presentation will occur at 7:30 am Pacific Time (10:30 am Eastern Time) at the Arizona Biltmore Hotel in Phoenix, Arizona.

An audio-only webcast of the presentation will be made vailable, both live and by replay, on the Investor Relations section of Amkor's website.


About Amkor

Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs. More information about Amkor is available from the company's filings with the Securities and Exchange Commission and on Amkor's website: www.amkor.com.


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