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TMCNet:  Market Research Reports, Inc. (www.marketresearchreports.com): MarketResearchReports.Com: Taiwanese IC Packaging and Testing Industry, 2Q 2014, New Report Launched

[June 30, 2014]

Market Research Reports, Inc. (www.marketresearchreports.com): MarketResearchReports.Com: Taiwanese IC Packaging and Testing Industry, 2Q 2014, New Report Launched

(M2 PressWIRE Via Acquire Media NewsEdge) Market Research Reports, Inc. has announced the addition of "Taiwanese IC Packaging & Testing Industry, 2Q 2014" research report to their website http://www.marketresearchreports.com This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry. Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world. The content of this report is based on primary data obtained through interviews, and publicly available information such as corporate financial statements. The report finds that shipment value of the Taiwanese IC packaging and testing industry continued to fall, by 6.9% sequentially, to around US$2.98 billion in the first quarter of 2014. In the second quarter, the industry is projected to see a double-digit growth rate in shipment value. The uptick is expected to continue in the third quarter of 2014.


Spanning over 14 pages, "Taiwanese IC Packaging & Testing Industry, 2Q 2014" report covering the Taiwanese IC Packaging and Testing Industry Shipment Value, 4Q 2011 - 3Q 2014, Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 4Q 2011 - 3Q 2014, Taiwanese IC Packaging Industry Shipment Value , 4Q 2011 - 3Q 2014, Taiwanese IC Testing Industry Shipment Value , 4Q 2011 - 3Q 2014, Taiwanese IC Packaging Industry's Shipment Value Rankings, 4Q 2011 - 1Q 2014, Taiwanese IC Packaging Industry Shipment Value by Vendors' Tier, 4Q 2011 - 1Q 2014, Taiwanese IC Testing Industry's Shipment Value Rankings, 4Q 2011 - 1Q 2014, Taiwanese IC Testing Industry Shipment Value by Vendors' Tier, 4Q 2011 - 1Q 2014, Taiwanese IC Packaging Industry Shipment Value by Shipment Destination, 4Q 2011 - 1Q 2014, Taiwanese IC Packaging Industry Shipment Value Share by Shipment Destination, 4Q 2011 - 1Q 2014, Taiwanese IC Testing Industry Shipment Value by Shipment Destination, 4Q 2011 - 1Q 2014, Taiwanese IC Testing Industry Shipment Value Share by Shipment Destination, 4Q 2011 - 1Q 2014, Exchange Rate, 4Q 2010 - 1Q 2014, Research Scope & Definitions. The report covered companies are - Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton Know more about this report at : http://mrr.cm/Zdv Find other Reports on Taiwan market at: http://www.marketresearchreports.com/countries/taiwan About Market Research Reports, Inc.

Market Research Reports, Inc. is the world's leading source for market research reports and market data. We provide you with the latest market research reports on global markets, key industries, leading companies, new products and latest industry analysis & trends.

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