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TMCNet:  Research and Markets: CREE CXA1520 Reverse Costing Analysis - CREE's Flip Chip First High Density LED Array

[June 30, 2014]

Research and Markets: CREE CXA1520 Reverse Costing Analysis - CREE's Flip Chip First High Density LED Array

DUBLIN --(Business Wire)--

Research and Markets (http://www.researchandmarkets.com/research/fqqw78/cree_cxa1520) has announced the addition of the "CREE CXA1520 - CREE's Flip Chip first High Density LED array - Reverse Costing Analysis" report to their offering.

The CXA1520 is the first high density LED array from CREE. With a breakdown voltage of 35V for a current of 0.5A (85°C), the CXA1520 generate 1710 lumens for 3000K and a CRI (News - Alert) of 80% in a 15.85mmx15.85mm package. The combination of Cree's proprietary Flip Chip SiC LEDs and high performance COB packaging, offers the one of best lumen density performance on the market.

The CXA1520 package has a very low thermal-resistance allowing for a lumen density similar to the one of discrete packaged LED but with a lumen per $ 30% higher (compared to equivalent package).

This reverse costing report provides an estimation of the production cost of the CXA1520-0000-000N00N430F. Describes theoverall manufacturing process and highlights key points of innovation developed by CREE.


COMPLETE TEARDOWN WITH:

  • Comparison of 3 LEDs ( 2 CREE and 1 Sharp (News - Alert)).
  • Detailed photos and identification
  • Manufacturing process flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

Key Topics Covered:

1. Overview / Introduction

  • Executive Summary
  • Comparison of LEDS
  • Reverse Costing Methodology

2. Companies Profile

  • CREE Profile

3. IPD65R225C7 Characteristics

  • CXA1520 Characteristics

4. IPD65R225C7 Physical Analysis

  • Package Views & Dimensions
  • Package Opening
  • Package Cross-Section
  • Phosphor
  • LED Assembly
  • LED Views & Dimensions
  • LED Singulation
  • Cathode and Anode
  • Dielectric Layers
  • Epitaxy
  • LED Thickness
  • LED Characteristics

5. Manufacturing Process Flow

  • Global Overview
  • LED Fabrication Unit
  • LED Process Flow
  • Package Fabrication Unit
  • Package Process Flow

6. Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • Epitaxy Step
  • LED Front-End Cost
  • LED Wafer Cost
  • LED Cost per process steps
  • LED Equipment Cost per Family
  • LED Material Cost per Family
  • Back-End : Probe and cleaving Cost
  • Packaging Cost
  • Final Assembly Cost
  • Component Cost & Price

7. Price Estimation

For more information visit http://www.researchandmarkets.com/research/fqqw78/cree_cxa1520


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