[September 08, 2014] |
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Etron Technology Presents "3D Imaging: Capabilities, Approaches and Future Applications" Talk and Demonstration at Image Sensors Americas 2014 in San Francisco, California
SAN FRANCISCO --(Business Wire)--
Advanced gesture recognition and sensing technology is coming to Image
Sensors Americas 2014. Etron Technology, Inc. (Taiwan GTSM:5351),
renowned for its innovative IC products and R&D capability, will present
a talk entitled "3D Imaging: Capabilities, Approaches and Future
Applications" at the Image Sensors Americas conference at Hyatt
Fisherman's Wharf in San Francisco, California on September 10-11, 2014.
The talk is scheduled to be presented at 11:30 am on September 11 by
Richard Crisp, Vice President of World Wide Marketing and Product
Development.
Etron Technology also will be demonstrating its revolutionary eSP870 3D
Depth Map Stereoscopic Camera controller in its exhibition space at the
conference. The demonstrations will show the benefits of using Etron's
hardware-based depth-map IC for manufacturing low-cost stereoscopic 3D
cameras that meet the cost targets appropriate for high-volume
cost-sensitive consumer products such as 3D scanners and gesture
recognition systems.
Because the eSP870 incorporates an on-chip hardware depth-map engine,
significant processing workload is off-loaded from the CPU / SOC
improving the user experience versus software-based approaches. The high
level of system integration in the eSP870 simplifies and miniaturizes
the stereo camera module design while featuring a minimum BOM cost. With
off the shelf availability and a simplified module design the eSP870 is
the low-risk path to market for high volume consumer products
incorporating high-performance 3D imaging technology at low cost.
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