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International Business Machines Assigned Patent for Method for Forming Two Device Wafers from Single Base Substrate Utilizing Controlled Spalling...(Targeted News Service Via Acquire Media NewsEdge) International Business Machines Assigned Patent for Method for Forming Two Device Wafers from Single Base Substrate Utilizing Controlled Spalling Process By Targeted News Service ALEXANDRIA, Va., Sept. 25 -- International Business Machines, Armonk, New York, has been assigned a patent (8,841,203) developed by five co-inventors for a "method for forming two device wafers from a single base substrate utilizing a controlled spalling process." The co-inventors are Stephen W. Bedell, Wappingers Falls, New York, Keith E. Fogel, Hopewell Junction, New York, Paul A. Lauro, Brewster, New York, Devendra K. Sadana, Pleasantville, New York, and Davood Shahrjerdi, Ossining, New York. The patent application was filed on June 14, 2011 (13/159,877). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,841,203.PN.&OS=PN/8,841,203&RS=PN/8,841,203 Written by Deviprasad Jena; edited by Jaya Anand. DJ0925JA0925-1064193 (c) 2014 Targeted News Service [ Back To TMCnet.com's Homepage ] |