Global System-On-A-Chip Industry

NEW YORK, Sept. 27, 2016 /PRNewswire/ -- This report analyzes the worldwide markets for System-on-A-Chip in US$ Million by the following Types: Mixed Signal SoCs, and Others. The Global market is further analyzed by the following End-Use Segments: Computers, Communication Equipment, Consumer Appliances, Automotive Applications, and Others. The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2015 through 2022. Also, a seven-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs. The report profiles 89 companies including many key and niche players such as -

Apple, Inc.
ARM Holdings Plc
Broadcom Corporation
Infineon Technologies AG
Intel Corporation

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I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations I-1 Disclaimers.............. I-2 Data Interpretation & Reporting Level I-2 Quantitative Techniques & Analytics I-3 Product Definitions and Scope of Study I-3

II. EXECUTIVE SUMMARY

1. INDUSTRY OVERVIEW.............. II-1 System-on-A-Chip (SoC): Introduction II-1 ICs with 14-nm Technology Nodes - Now a Commercial Reality II-2 The Technology Roadmap..............II-3 How Long Will the Moore's Law Hold True? II-3 Transistor Count (1970-2015) & Moore's law II-5 Embracing New Changes in Design Methodology II-5 Recent Past & Current Market Scenario II-6 Ongoing Transition of the World Electronics Industry in the Midst of Anemic Global Growth, Elicits a Mixed Outlook for SoCs Beyond 2016.............. II-7 Table 1: Weak Macro-Economic Forces Push the Capacitors Market into a Rough Growth Patch: World Real GDP Growth Rates in % by Country/Region for the Period 2014-2017 (includes corresponding Graph/Chart) II-9 Outlook.............. II-9

2. MARKET TRENDS & GROWTH DRIVERS..............II-10 Growing Demand for Smart, Energy Efficient Electronic Devices Creates Strong Business Case for SoC II-10 Miniaturization of Electronics - A Major Factor Influencing Demand for SoCs.............. II-10 Compact Size of Logic Devices Favors Growth II-10 Mixed Signal System-on-a-Chip Dominates the Market II-11 Multicore SoCs Gain Widespread Acceptance II-11 SoCs Find Increasing Applications in Embedded Systems II-12 Communication Equipment - The Most Prominent End-Use Application Area for SoCs..............II-13 High-End Smartphones Boosts Demand for SoCs II-13 Manufacturers Target Low-End Smartphones to Increase Share in Emerging Markets..............II-14 Table 2: Global Market for Smartphones (2013, 2015 & 2019): Breakdown of Volume Sales in Million Units by Geographic Region (includes corresponding Graph/Chart) II-14 Growing Adoption of Media Tablets Increases Market Prospects for SoCs.............. II-14 Table 3: Global Market for Media Tablets: Annual Sales Figures (in Million Units) for years 2015 & 2018 (includes corresponding Graph/Chart)..............II-15 Companies Aim at SoCs integrated with 3G and 4G LTE Capabilities II-16 SMEs Place Demand for SoCs in Multi-service Business Gateways II-16 Computers and Consumer Appliances Add to the Growth Prospects II-17 SoCs Foray into Ultrabooks and Laptops II-17 Table 4: Global Market for Ultrabooks: Annual Shipments (in Million Units) for years 2011 & 2016 (includes corresponding Graph/Chart).............. II-17 SoCs in Smart TVs Drives Growth II-18 Table 5: Global Market for Smart TVs: Annual Shipments (in Million Units) for years 2013, 2016 & 2019P (includes corresponding Graph/Chart)..............II-18 Applications in Set Top Boxes Boosts Demand for SoCs II-18 Evolving Car Electronics and Resurgence in Auto Production to Drive Gains.............. II-19 Table 6: World Automotive Production by Geographic Region/Country (2015, 2017 & 2020) (in '000 Units) (includes corresponding Graph/Chart)..............II-19

Table 7: Continuous Digital Innovation & The Resulting Expansion of Connected Car Technologies to Spur the Importance of SoCs: Global Market for Connected Car Technologies (in US$ Billion) by Category (includes corresponding Graph/Chart)..............II-20

Table 8: Breakdown of Value of Semiconductor Content Per Car (in US$) by Car Type (includes corresponding Graph/Chart) II-20

Table 9: Breakdown of Average Value of Semiconductor Content Per Car (US$) by Type of Semiconductor Content (includes corresponding Graph/Chart)..............II-20 Medical Field Opens New Growth Opportunities II-21 SoC Technology Deployments in Industrial Automation II-21 Applications in Smart Grid Expected to Drive Future Growth II-21 High Demand for Radar Boosts the SoC Market II-22 "Internet of Things" to Open New Growth Avenues for SoCs II-22 Reducing Cost Per Function of ICs Boosts Market Fortune for SoCs II-22 Technology Developments - Key to the Success of SoC Market II-22 Need to Enhance SoC Performance..............II-24 Multiple Processor SoCs Makes the Cut II-24 Emergence of Quadcore & Octacore Processor SoCs II-25 Technology Developments Primarily Geared Towards Production of Compact Design SoCs with High Performance & Energy Efficiency Capabilities.............. II-25 Shift towards Low Power Processor SoCs II-25 Temperature Aware Designs Gathers Steam II-26 3D Chip Appeal Widens Among End-Use Sectors II-26 Network-On-Chip Technology Critical to the Efficiency of SoC II-26 FPGA SoCs - A Key Development..............II-27 Development of Premanufactured ASICs, and Flash- and SRAM- Series of FPGAs.............. II-27 Customization to Meet Client's Requirements II-28 Innovations Address Power Leakage and Multiple Tasks Handling II-29 Developing Countries Excel in Growth Prospects II-29

3. CHALLENGES & ISSUES..............II-31 Lack of Standardization in Intellectual Property Cores II-31 Memory Bandwidth and Latency..............II-31 Issues Related to Marketing of ICs II-31 High Costs, a Major Deterrent..............II-31 Table 10: Major Elements of Design Costs (includes corresponding Graph/Chart)..............II-32

Table 11: Design Costs by process Node (includes corresponding Graph/Chart)..............II-32 Time-to-Market Pressures..............II-33 Power Consumption.............. II-33 Transistor Variability..............II-33 Verification Challenges..............II-34 Testers - A Solution to the Challenge II-34 IP Compatibility Issue..............II-35 Customer & Software Support and Staffing Challenges II-35 System-in-Package (SiP): A Potential Threat to System-on-a-Chip II-36

4. PRODUCT OVERVIEW.............. II-37 SoC - An Introduction..............II-37 Components of SoC..............II-37 System-on-a-Chip (SoC) Block Diagram II-37 Developments in ICs Over the Years II-38 SoC Design Benefits.............. II-38 Mixed-Signal SoCs.............. II-38 "Second-Generation" SoCs..............II-38 ASIC SSOC - A New Dimension..............II-39 SoC Device Types.............. II-39 Standard Cells.............. II-39 Embedded IP.............. II-39 Micro Logic IP.............. II-39 Memory IP.............. II-39 ASIC/PLD IP.............. II-39 Analog IP & Other Components..............II-40 Standards For SOCs..............II-40 SoC Processor Types.............. II-40 Soft Instruction Processors..............II-40 Configurable Processors..............II-41 Total Design Strategies for SoC..............II-41 Architecture Strategy..............II-41 Design-for-Test Strategy..............II-41 Validation Strategy..............II-41 Synthesis and Back-End Strategy II-42 Integration Strategy..............II-42 End-Use Applications..............II-42 Computers.............. II-42 Communications Equipment..............II-43 Consumer Appliances..............II-43 Automotive Applications..............II-43 Others.............. II-44 Industrial Automation & Military II-44 Medical & Office Devices..............II-44 CRM and Hearing Aid Products Dominate the Category II-44 New Mixed-Signal Radio-Frequency (RF) Technology Design II-44 SoC-Equipped Nanorobots..............II-45

5. SOC INTELLECTUAL PROPERTY (IP)..............II-46 IP Cores Per SoC.............. II-46 Development of Reusable IPs..............II-47 Third Party IP.............. II-47 EDA and Silicon Intellectual-Property (IP), Two Burgeoning Sectors.............. II-48 Interconnect - A Growing Sector of Semiconductor IP Market II-48

6. PRODUCT LAUNCHES/INTRODUCTIONS..............II-49 Qualcomm to Introduce New Qualcomm® Snapdragon™ Wear 1100 SoC for Special-Purpose Wearable Devices II-49 Marvell Unveils Breakthrough 64-bit Dual-Core SoC Platform II-49 Altera Introduces Transceiver Technology II-49 Tensorcom develops 802.11ad 60 GHz System on Chip (SoC) with Integrated USB 3.0.............. II-49 EFFECT Photonics Introduces optical System-on-Chip II-49 Marvell Rolls Out 32-bit and 64-bit ARMADA® system-on-chip (SoC) II-50 Mentor Graphics Corporation Releases Mentor® Embedded Linux® II-50 Renesas Electronics Releases R-Car D1 Series II-50 Xilinx Develops Expanded Ecosystem & Hardware Platforms II-50 Qualcomm Introduces Snapdragon Wear 2100 SoC for Wearables II-50 Altera Introduces EN6362QI PowerSoC II-50 Telink Semiconductor Develops TLSR8269 II-51 Marvell Unveils ARMADA® 3700 system-on-chip II-51 Qualcomm Technologies Develops Bluetooth® Smart 4.2 System-on -Chip.............. II-51 MediaTek Unveils MediaTek MT8581, MT2523G and MT7697 II-51 Renesas Electronics Rolls Out R-Car H3 II-51 Texas Instruments Introduces TMS320F28379D and TMS320F28379S II-52 Mentor Graphics Releases Vista™ virtual platforms II-52 STMicroelectronics Introduces STCOMET smart-meter SoC II-52 Qualcomm Atheros Launches IPQ40x8/x9 SoC II-52 Renesas Electronics Develops R-Car W2R System-On-A-Chip II-52 Renesas Launches R-Car T2 system-on-a-chip (SoC) II-53 STMicroelectronics Develops Cannes Wi-Fi (STiH390) SoC II-53 Marvell Introduces 64-bit quad-core ARMADA Mobile PXA1918 R10 LTE SoC.............. II-53 Zilog Unveils MG2475..............II-53 Microsemi Launches Automotive-grade FPGAs and SoC FPGAs II-53 Broadcom Rolls Out StrataDNX™ Switch SoC II-54 Intel Unveils Xeon-based SoC..............II-54 Intel Rolls Out Intel Atom x3 and Intel XMM 7360 LTE II-54 Freescale Unveils S32V..............II-54 Broadcom Releases 5G WiFi Chips & System-On-Chip II-54 Atmel Rolls Out Power Line Communication SoC for Smart Metering II-55 Qualcomm Develops Qualcomm® FSM90xx System-on-Chip II-55 Broadcom Unveils Bluetooth-Enabled System-on-a-Chip II-55

7. RECENT INDUSTRY ACTIVITY..............II-56 Microsemi Collaborates with Solectrix to Launch SmartFusion2- SoC-FPGA-Based-System-on-Module II-56 MStar Collaborates with Conax..............II-56 Avago Takes Over Broadcom..............II-56 Visteon Corporation Snaps Up AllGo II-56 TSMC Inks an Agreement with ARM..............II-57 Intel Takes Over Altera..............II-57 ARM Takes Over Carbon..............II-57 Altera Enters into a Partnership with Intrinsic II-57 MediaTek Enters into Partnerships with Amazon, Tinitell, Apple and People Power.............. II-57 Xilinx Inks an Agreement with Land Transport Authority of Singapore.............. II-58 Texas Instruments Collaborates with LGS Innovations II-58 Arteris Enters into a Partnership with YOGITECH II-58 Altera Enters into Collaboration with Mentor Graphics II-58 Altera Expands Partnership with ARM II-58 Cadence Design Systems Inks an Agreement with ARM II-59 Renesas Collaborates with IAR Systems for R-IN32M3 SoCs II-59 Intel Enters into a Partnership with Rockchip II-59

8. FOCUS ON SELECT PLAYERS..............II-60 Apple, Inc. (US).............. II-60 ARM Holdings Plc (UK)..............II-60 Broadcom Corporation (US)..............II-61 Infineon Technologies AG (Germany) II-61 Intel Corporation (US)..............II-61 Altera Corporation (US)..............II-62 LSI Corporation (US)..............II-63 Marvell Technology Group Ltd. (US) II-63 Mentor Graphics Corporation (US) II-64 Microsemi Corp. (US)..............II-64 NVIDIA Corporation (US)..............II-65 NXP Semiconductors N.V. (The Netherlands) II-65 Palmchip Corporation (US)..............II-66 Qualcomm Incorporated (US)..............II-66 Renesas Electronics Corporation (Japan) II-66 Samsung Electronics Co., Ltd. (South Korea) II-67 STMicroelectronics (Switzerland) II-67 Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan) II-68 TexasInstruments, Inc. (US)..............II-68 Toshiba America Electronics Components, Inc. (US) II-69 Xilinx, Inc. (US).............. II-69 Zilog, Inc. (US).............. II-70

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 89 (including Divisions/Subsidiaries - 94)

The United States (46) Canada (1) Japan (6) Europe (15) - France (1) - Germany (3) - The United Kingdom (4) - Rest of Europe (7) Asia-Pacific (Excluding Japan) (23) Latin America (1) Middle East (2)
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