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AT&S BU Mobile Device & Substrates CEO receives Top Shanghai Magnolia Award
[September 28, 2016]

AT&S BU Mobile Device & Substrates CEO receives Top Shanghai Magnolia Award


SHANGHAI, Sept. 28, 2016 /PRNewswire/ -- The Shanghai Municipal Government today granted the 2016 Shanghai Magnolia Gold Award to Chen-Jiang Phua, AT&S Business Unit Mobile Device & Substrates CEO. The award recognizes Mr. Phua's contributions to Shanghai's economic and social development. Mr. Yang Xiong, Mayor of Shanghai, presented awards to Mr. Phua and other nine winners in the city hall on 28 September 2016.  It is the first time for an executive from an Austrian company to receive this top award.

Mr.Phua, AT&S BU MS CEO, receiving Shanghai Magnolia Award from Mr. Yang Xiong, Mayor of Shanghai

 

2016 Presentation Ceremony of Shanghai Magnolia Award

Named after the city flower of Shanghai, the Magnolia Award was set up by the Foreign Affairs Office of the Shanghai Municipal Government in 1989. The annual award consists of two categories, silver and gold award, acknowledging foreign individuals who have made outstanding contributions to Shanghai. Mr.Phua was the Magnolia Silver Award recipient in 2008.



Born in Singapore, Mr. Phua takes charge of Global Business Unit Mobile Device & Substrates CEO as well as Chairman of the Board AT&S China. He spent over 18 years in China including the recent 11 years working and living in Shanghai. AT&S in Shanghai has experienced
a fast development and has been ranked as the largest HDI PCBs (High Density Interconnect Printed Circuit Boards) manufacturing site worldwide since 2008. The company not only meets the growing demand of domestic customers but also ships its products to overseas markets in Europe and America, prompting the competitiveness of "Chinese Manufacturing".

"Magnolia Gold Award is an honor that I share with my AT&S Shanghai Team as well as the PCB and IC substrates industry. The great recognition motivates me and all our employees to continue contributing to the prosperity and sustainable development of both Shanghai and China," Mr. Phua said.


Shanghai is a cornerstone of AT&S's success. As the largest Austrian investor in China, AT&S has invested in high-tech and innovation in Shanghai since 2001. To pursue the goal of sustainable growth, the company taped into IC substrates market by bringing the next generation of HDI technology - substrate-like PCBs to Shanghai in 2015. It was driven by the megatrend ongoing miniaturization and modularization with the structure of about 20 to 30 micrometers to meet the potential applications for wearables and IoT solutions. 

Mr. Phua further commented,"with its excellent government framework and strategic focus, economic development, strong logistics, enormous R&D and human resources potential, we are convinced that Shanghai is the ideal location for the latest high-end technology development and smart manufacturing."

AT & S Austria Technologie & Systemtechnik AG - First choice for advanced applications

AT&S is the European market leader and one of the globally leading manufacturers of high-value printed circuit boards. AT&S industrialises leading-edge technologies for its core business segments Mobile Devices, Automotive, Industrial, Medical and Advanced Packaging. In 2016, AT&S produces two new, leading-edge technologies at the new site in Chongqing (China) – IC substrates and substrate-like printed circuit boards for high-end applications. As an international growth enterprise, AT&S has a global presence, with production facilities in Austria (Leoben and Fehring) and plants in India (Nanjangud), China (Shanghai, Chongqing) and Korea (Ansan, near Seoul). The company employed an average of 8,759 people in the financial year 2015/16. For more information: www.ats.net

Photo - http://photos.prnasia.com/prnh/20160928/0861610022-a
Photo - http://photos.prnasia.com/prnh/20160928/0861610022-b


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