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Global IC Manufacturing Equipment and Materials Market Report 2016: Focus on Technology Trends, Products & Applications - Research and MarketsDUBLIN, October 21, 2016 /PRNewswire/ -- Research and Markets has announced the addition of the "The Global Market for Equipment and Materials for IC Manufacturing." report to their offering. This report examines and projects the technology of equipment and materials involved in the fabrication of VLSI semiconductor devices, their likely developments, why and when their introduction or demise will take place, what problems and choices are facing users, and where the opportunities and pitfalls are. 3.1 Optical Systems 3.2 EUV 3.3 Electron Beam Lithography 3.4 Ion Beam Lithography 3.5 Nano-Imprint Lithography Chapter 4 CMP Issues and Trends 4.1 Need for Planarity 4.2 Applications 4.3 Planarization Techniques 4.4 Chemical Mechanical Polishing (CMP) Chapter 5 Factory Automation Issues and Trends 5.1 Introduction 5.2 Elements of Automation 5.3 Flexible Automation 5.4 Reliability 5.5 Tool Issues and Trends 5.6 E-Manufacturing Chapter 6 Thin film Deposition Issues and Trends 6.1 Physical Vapor Deposition 6.2 Chemical Vapor Deposition (CVD) Techniques Chapter 7 Plasma Etching Issues and Trends 7.1 Introduction 7.2 Processing Issues 7.3 Plasma Stripping Chapter 8 Chemicals and Materials Issues and Trends 8.1 Technology Issues 8.2 Purity Requirements 8.3 Chemical Management 8.4 Gases 8.5 Sputtering and Evaporation Materials Chapter 9 Metrology 9.1 Defect Review/Wafer Inspection 9.2 Thin Film Metrology 9.3 Lithography Metrology Chapter 10 Market Forecast 10.1 Market Drivers 10.2 Market Forecast Assumptions 10.3 Low-K Market 10.4 Lithography Market 10.5 CMP Market 10.6 Factory Automation Market 10.7 Thin Film Deposition Market 10.8 Plasma Etching Market 10.9 Chemical and Materials Market 10.10 Metrology Market For more information about this report visit http://www.researchandmarkets.com/research/b4cbj2/the_global_market Media Contact: Research and Markets |