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Teardown of Huawei's Mediapad M3 8.4: Hisilicon Kirin 950, Octa-Core, Hi3650, 4GB Mobile DDR4, 64GB eMMC NAND, 8.4" TFT-LCD, 2560x1600, GFF type Touchscreen & Wi-Fi/3G/4G support - Research and Markets
[May 22, 2017]

Teardown of Huawei's Mediapad M3 8.4: Hisilicon Kirin 950, Octa-Core, Hi3650, 4GB Mobile DDR4, 64GB eMMC NAND, 8.4" TFT-LCD, 2560x1600, GFF type Touchscreen & Wi-Fi/3G/4G support - Research and Markets


Research and Markets has announced the addition of the "Teardown - Huawei Mediapad M3 8.4" report to their offering.

This Huawei (News - Alert) Mediapad M3 8.4 teardown report features a full BOM with cost benchmarking and component analysis, Delivered by our team of industry experts - helping you balance device cost and make decisions critical to your success.

Today's complex global supply chain and rapid technology innovation necessitate smart component cost and hardware design choices. Our solutions deliver comprehensive, industry-trusted insights that help you balance device cost with the features that will satisfy today's highly competitive marketplace. Delivered by a team of experts with over 13 years of experience, our teardown reports deliver the depth, breadth, andaccuracy you need to make cost-effective tactical and strategic decisions.



Highlights

  • Hisilicon Kirin 950, Octa-Core, Hi3650
  • 4GB Mobile DDR4, 64GB eMMC NAND
  • 8.4" TFT-LCD, 2560x1600, GFF type Touchscreen
  • Wi-Fi/3G/4G support

Each teardown report includes:


  • Comprehensive, industry-trusted insights that help you balance device cost and make cost-effective tactical and strategic decisions
  • A complete assessment of all electronic, electro-mechanical, and mechanical components
  • A detailed market, manufacturing, and cost analysis from our team of industry experts
  • An exhaustive photographic inventory of all device components

Key Topics Covered:

I. Executive Dashboard

II. Overall Cost Model

III. IC Price Evaluator

IV. Bill of Materials

V. Cost Estimation

VI. Global Manufacturing Wage Study

VII. Methodology

VIII. Device Overview

For more information about this report visit http://www.researchandmarkets.com/research/tc7dbl/teardown_huawei


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