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AI Hardware Summit 2019: Booth-to-Booth eSilicon 58G DSP-Based SerDes Demonstration Over a Five-Meter Samtec Copper CableSAN JOSE, Calif., Sept. 12, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will partner with Samtec, a leading global manufacturer of electronic interconnect solutions, to deliver a rare booth-to-booth long-reach SerDes demonstration at AI Hardware Summit 2019. What & When This demonstration highlights the SerDes performance, robustness and architectural flexibility supporting independent data rates and protocols on each individual lane (e.g., 50G PAM4 Ethernet, 24G NRZ CPRI and proprietary protocols up to 58Gb/s). A broad set of monitoring and diagnostic tools are available through the eSilicon SerDes evaluation module kit and its graphical user interface to control, observe and analyze signal quality and performance metrics across the link in real time, including:
Computer History Museum Mountain View, Calif., USA The AI Hardware Summit USA is the first and only conference dedicated solely to the ecosystem developing hardware accelerators for neural networks and computer vision. Over 500 attendees are expected. Nearly 40 companies—including hyperscalers, semiconductor companies, device manufacturers and the critical mass of AI hardware start-ups from across the globe—will present their approaches to processing machine learning training and inference workloads in both server and client computing. About eSilicon Collaborate. Differentiate. Win.™ eSilicon is a registered trademark, and the eSilicon logo, neuASIC and “Collaborate. Differentiate. Win.” are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.
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