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VoIP Routers - CEVA Licenses Multiple CEVA-TeakLite-4 DSP Cores to Yamaha

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February 26, 2014
CEVA Licenses Multiple CEVA-TeakLite-4 DSP Cores to Yamaha

By Calvin Azuri, TMCnet Contributor

CEVA, Inc. (News - Alert) recently announced that it has licensed multiple instances of its CEVA-TeakLite-4 DSP family of cores to Yamaha.  The cores are designed for handling extremely complex pre-processing and post-processing of voice and audio algorithms, including always-on voice activation. According to the company, the TweakLite product line offers all these high-end features with extremely low power consumption.

In a statement, Gideon Wertheizer, CEO of CEVA, said, “We are delighted to announce Yamaha (News - Alert) Corporation as the latest company to choose our CEVA-TeakLite-4 DSP architecture for their audio/voice product lines. Yamaha is a recognized leader in high-quality audio and voice processing technology and our DSP provides them with a fully programmable platform featuring ample processing horsepower to implement even the most sophisticated audio and voice use-cases.”

CEVA-TeakLite is touted as the most successful licensable DSP architecture in the semiconductor industry, with 3 billion audio/voice chips shipped spanning more than 100 licensees, embedded in over 100 audio and voice software packages with around 30 active ecosystem partners worldwide. CEVA-TeakLite-4 is offered as a scalable platform and extensible architecture framework, which enables users to choose the optimal core based on their specific requirements for audio/voice applications.

In a statement, Nobukazu Nakamura, manager of Strategic Marketing Department, Semiconductor Division at Yamaha, said, “Our comprehensive selection process has led us to understand clearly that the CEVA-TeakLite-4 cores have the industry-leading audio/voice DSP architecture, the smallest footprint, and the best power efficiency for mobile product ICs. We continue to work together with CEVA for the continual advancement of our audio/voice product roadmap, integrating leading-edge technologies, yet achieving better performance and greater power efficiency at the same time.”

Edited by Blaise McNamee

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