Sixty-six companies have come together to introduce a new and improved high-density, high-speed networking solution. QSFP-DD release 4.0 has better keying, synchronous clocking, and thermal section additions.
The same group has released the 3.0 Common Management Interface Specification. That delivers management interactions and a register map for 8 and 16 lane modules.
QSFP-DD stands for Quad Small Form Factor Pluggable Double Density. It’s a hardware form factor. It supports up to 400 Gbps on an 8 x 50 Gbps electrical interface.
Meanwhile, the CMIS is a management specification that defines the host-to-module interactions needed to ensure that modules will initialize and operate consistently through the management interface. It will address an array of module form factors, functionalities and applications. That ranges from coherent DWDM modules to passive copper cable assemblies.
“Through strategic collaborations we are able to provide specifications that address the challenges of common management requirements for the mechanical, thermal and electrical parameters,” said Tom Palkert, the QSFP-DD MSA specifications editor. “The CMIS breaks the barriers to multi-vendor interoperability by addressing the ability of next-generation modules to meet user needs.”
QSFP-DD MSA founder-promoters include Broadcom (News - Alert), Cisco, Corning, Finisar, Foxconn Interconnect Technology, Huawei, Intel, Juniper Networks, Lumentum, Luxtera, Mellanox Technologies, Molex, Oclaro, and TE Connectivity (News - Alert). Contributors include Acacia, ACON, Alibaba, Amphenol, Applied Optoelectronics, APRESIA Systems, Cavium, Celestica, Ciena, ColorChip, Credo, Dell EMC, Delta Products, Dust Photonics, Eoptolink, Fourte, Fujitsu Optical Components, Genesis, H3C, Hisense (News - Alert) Broadband, Hitachi Metals, Hewlett Packard Enterprise, InnoLight, Innovium, Inphi, Ixia, JPC, Kaiam, LEONI, Lorom, Luxshare-ICT, MACOM, MaxLinear, MultiLane, NeoPhotonics, Nokia (News - Alert), Panduit, PHY-SI, Ranovus, Samtec, SENKO, Semtech, Sicoya, Siemon, Skorpios Technologies, Source Photonics, Spectra7 Microsystems, Spirent, Sumitomo Electric, US Conec, Xilinx (News - Alert), and Yamaichi Electronics.
Edited by Maurice Nagle