Coherix, a provider of advanced vision measurement and inspection solutions for manufacturing, has announced the availability of OPIS, its newest sensor for electronics and semiconductor customers.
OPIS (Optical Precising Inspection System) is a 2D inspection product that makes use of the advanced design and applications. This unique product provides various features for the increasing demands in 2D inspection.
Allowing for easy setup and calibration with an internal encoder controller that syncs with the strobe and camera, OPIS can measure multiple parts simultaneously, on the fly, and has high Units per Hour (UPH). OPIS is compact and is also available for Ball Grid Array (BGA) & Quad Flat No-Lead (QFN) inspection.
Coherix enters into partnerships with various local universities, which includes the University of Michigan to complete research that leads to Coherix product development. Allowing Coherix to bring to market and serve current and new customers, this innovative collaboration creates a steady pipeline of new technologies, the company stated in a statement.
“We have been supplying our semiconductor customers with high-performance, on-the-fly, 3D positioning and inspection systems for over 5 years now.” said Jon Upham, Coherix director of application engineering. “OPIS was designed and built as a direct response from our customers for the same capability in 2D. We took the lighting and control technology from our 3DX family of inspection systems and incorporated it into a smaller, lower cost package to create OPIS.”
Recently, the company unveiled Tru3D, its newest vision based product for assembly verification. Tru3D makes use of an opulent set of three-dimensional (3D) profile data to produce vision solutions that are more dependable, simpler to use, and lower cost to own when compared to conventional ways of human inspection, mechanical probes and sweeps, and two-dimensional vision inspection systems.
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Edited by Rachel Ramsey